| PART |
Description |
Maker |
| 4832-6000-CP 4832-6004-CP 4820-3004-CP 4840-6000-C |
Dual leaf, high compression contact provides reliable termination
Stamped and Formed, Dual-Wipe
|
3M Electronics
|
| 530286-2 |
.100, .125, .150, .156 C/L Twin Leaf Mother Board Connectors; TWIN LEAF KEYING PLUG .150CL ( AMP )
|
Tyco Electronics
|
| 5-583294-2 |
.156 Centerline Connectors (AMP-LEAF); CONT AMP LEAF L/P 15 AU ( Tyco Electronics )
|
Tyco Electronics
|
| SM5903BF00 |
compression and non compression type shock-proof memory controller
|
Nippon Precision Circuits Inc
|
| 61668-1 61668-4 3-61668-1 |
CONTACT, BIFURCATED LEAF
|
Tyco Electronics
|
| 0472330001 47233-0001 SD-47233-001 |
1.20mm (.047) Pitch Compression Dual Row Key Pad Connector, 8 Circuits, Surface Mount, Solder Tail Gold (Au) Flash
1.20mm (.047") Pitch Compression Dual Row Key Pad Connector, 8 Circuits, Surface Mount, Solder Tail Gold (Au) Flash
|
Molex Electronics Ltd.
|
| TS272MP TS272IN TS272MN TS272MD TS272ID TS272M TS2 |
DUAL OP-AMP, 6500 uV OFFSET-MAX, 3.5 MHz BAND WIDTH, PDIP8
HIGH PERFORMANCE CMOS DUAL OP-AMPS
HIGH PERFORMANCE CMOS DUAL OPERATIONAL AMPLIFIERS
HIGH SPEED CMOS DUAL OPERATIONAL AMPLIFIERS 高速CMOS双运算放大器
|
ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
意法半导
STMicroelectronics N.V.
|
| ENL9654 |
Compression Range: 55 dB
|
API Technologies Corp
|
| BCL-3038-PL |
Compression Style Ring Tongue
|
Molex Electronics Ltd.
|
| 0192210247 |
Compression Style Ring Tongue
|
Molex Electronics Ltd.
|
| MPC566 MPC566CZP40 |
RISC MCU with Code Compression Option
|
Motorola, Inc.
MOTOROLA INC
|
