| PART |
Description |
Maker |
| N111252 |
PACKAGING: TAPE AND REEL/ 4000 PIECES PER
|
E-SWITCH
|
| 87911-2811 0879112811 |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0903257006 90325-7006 |
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, with PCB Pegs, 6 Circuits, Tube Packaging
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, with PCB Pegs, 6 Circuits, Tube Packaging
|
Molex Electronics Ltd.
|
| 0903257008 90325-7008 |
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, with PCB Pegs, 8 Circuits, Tube Packaging
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, with PCB Pegs, 8 Circuits, Tube Packaging
|
Molex Electronics Ltd.
|
| 90325-9014 |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 14 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 14 Circuits, Tin (Sn) Plating, Tube Packaging
|
Molex Electronics Ltd.
|
| 90325-9010 |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 10 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 10 Circuits, Tin (Sn) Plating, Tube Packaging
|
Molex Electronics Ltd.
|
| 90325-9008 |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 8 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 8 Circuits, Tin (Sn) Plating, Tube Packaging
|
Molex Electronics Ltd.
|
| OV7411N OV7635 OV9630 OV7648 OV7431 |
MCU CMOS 18LD 4MHZ 1K EPRM, 0C to 70C, 18-PDIP, TUBE
MCU CMOS 18LD 20MHZ 1K EPRM, 0C to 70C, 18-SOIC 300mil, TUBE
MCU CMOS 18LD 20MHZ 1K EPRM, -40C to 85C, 18-PDIP, TUBE
MCU CMOS 20LD 20MHZ 1K EPRM, -40C to 85C, 20-SSOP 208mil, TUBE
packaging specifications
MCU CMOS 18LD 4MHZ 1K EPRM, -40C to 85C, 18-PDIP, TUBE /黑白| NTSC制式| 508 × 492 |模拟|的CameraChip |技术报
|
Omnivision Technologies Inc.
|
| 0903257026 90325-7026 |
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, with PCB Pegs, 26 Circuits, Tube Packaging
|
Molex Electronics Ltd.
|
| 0878980526 87898-0526 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 5 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
|
Molex Electronics Ltd.
|
| 35362-1076 |
2.00mm (.079) Pitch Sherlock Wire-to-Board Header, Vertical, with Positive Lock, 10Circuits, with Kinked PC Tails, Natural, Tube Packaging
|
Molex Electronics Ltd.
|
| 0353620287 35362-0287 |
2.00mm (.079) Pitch Sherlock Wire-to-Board Header, Vertical, with Positive Lock, 2Circuits, without Kinked PC Tails, Red, Tube Packaging
|
Molex Electronics Ltd.
|
|
