| PART |
Description |
Maker |
| WS128K32-35G1UMA |
128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68
|
WHITE ELECTRONIC DESIGNS CORP
|
| DPS128X16AA3-35C DPS128X16AA3-45I DPS128X16AA3-45M |
128K X 16 MULTI DEVICE SRAM MODULE, 35 ns, CPGA50 STACK, CERAMIC, PGA-50
128K X 16 MULTI DEVICE SRAM MODULE, 45 ns, CPGA50 STACK, CERAMIC, PGA-50
|
Twilight Technology, Inc.
|
| AS8S512K32AQ1-25L_Q AS8S512K32P-17L/IT AS8S512K32P |
512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68
512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68
512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68
512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 PGA-66
512K x 32 SRAM SRAM MEMORY ARRAY
|
Micross Components
Austin Semiconductor
|
| EDI8C32128C WS128K32-XXX EDI8C32128LP17EI |
128Kx32 SRAM Module(低功耗CMOS12Kx32静态RAM模块（存取时5705555ns
128Kx32 SRAM Module(低功耗CMOS28Kx32静态RAM模块（存取时5705555ns
128Kx32 SRAM Module(低功耗CMOS12Kx32静态RAM模块（存取时57055555ns
128Kx32 SRAM Module(低功耗CMOS28Kx32静态RAM模块（存取时57205555ns 128Kx32 SRAM的模块（低功耗的CMOS28Kx32静态内存模块（存取时间15,17,20,25,35,45,55纳秒））
128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68
|
White Electronic Designs Corporation
TE Connectivity, Ltd.
|
| EDI8L24129V-BC EDI8L24129V12BI EDI8L24129V EDI8L24 |
10ns; 3.3V power supply; 128K x 24 SRAM
SRAM MCP
SDR Connector; No. of Contacts:26; Pitch Spacing:0.8mm; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
128K X 24 SRAM 3.3 VOLT 128K的X 24 SRAM.3
15ns; 3.3V power supply; 128K x 24 SRAM
|
Electronic Theatre Controls, Inc.
White Electronic Designs
|
| WED2ZL361MSJ-BC WED2ZL361MSJ26BI WED2ZL361MSJ42BC |
NBL SSRAM MCP
1M X 36 MULTI DEVICE SRAM MODULE, 2.6 ns, PBGA119
1M X 36 MULTI DEVICE SRAM MODULE, 4.2 ns, PBGA119
|
WHITE ELECTRONIC DESIGNS CORP
|
| SYS32256LK-30 SYS32256ZK-30 SYS32256LKLI-30 SYS322 |
256K X 32 MULTI DEVICE SRAM MODULE, 30 ns, SMA64 PLASTIC, SIMM-64
256K X 32 MULTI DEVICE SRAM MODULE, 30 ns, ZMA64 PLASTIC, ZIP-64
|
TE Connectivity, Ltd.
|
| PUMA67S4000M-020 PUMA67S4000M-35 PUMA2S4000M-020 P |
SRAM|128KX32|CMOS|LDCC|68PIN|CERAMIC
2NS, 352 BGA, COM TEMP(FPGA)
SRAM|128KX32|CMOS|PGA|66PIN|CERAMIC
10 MHZ, 3.3V, 44 PLCC, IND TEMP(FPGA)
10MHZ, 20 PLCC, COM TEMP(FPGA) 静态存储器| 128KX32 |的CMOS |美巡赛| 66PIN |陶瓷
128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQMA68
|
NIC Components, Corp.
|
| CYM1851V33P8-15C CYM1851V33PN-25C CYM1851V33PN-35C |
1,024K x 32 3.3V Static RAM Module
1M X 32 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72 ANGLED, PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 25 ns, PSMA72 ANGLED, PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72
|
Cypress Semiconductor, Corp.
|
| MSM8256V-55/X0252 MSM8256V-025/X0252 MSM8256VM-025 |
256K X 8 MULTI DEVICE SRAM MODULE, 55 ns, CDIP32
256K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDIP32
256K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CDXA32
|
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