| PART |
Description |
Maker |
| TMS27PC512-12DDE TMS27PC512-12DDE4 TMS27PC512-10DU |
PLCC Clip-on Adapters; Top Pin Count: 32; Bottom Pin Count: 32; Part Description: PLCC IC Clip;
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.5; IC Size X (mm): 4; IC Size Y (mm): 4; Socket Lid: Swivel; Max Pincount: 20; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.65; IC Size X (mm): 6; IC Size Y (mm): 6; Socket Lid: Swivel; Max Pincount: 28; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
x8 EPROM x8存储
FPGA Development: XILINX; Top Pin Count: 84; Bottom Pin Count: 84; Top Interface: PLCC SOCKET; Bottom Interface: PLCC PLUG; Device Specific: yes; Devices Supported: XC3020, 3030, 3042; Part Description: Xilinx FPGA adapter; x8存储
|
Maxim Integrated Products, Inc.
Clare, Inc.
TE Connectivity, Ltd.
|
| SYC130 NEC256 SHC130 SEC130 SGC130 SRC130 NEC250 S |
LED Displays
Optoelectronic
From old datasheet system
Intel® 82566MC Gigabit Ethernet PHY, Single Port, Pb-Free 2LI, FCBGA, Tray
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0659-0 05; No. of Positions: 18; Connector Type: Wire
(degrees C): -55 to 85; Generic Name: D-SUB; General Description: Receptacle; Right angle; Inch type screw; MIL-C-24308
C): -55 to 85; Generic Name: D-SUB; General Description: Receptacle; Right angle; Locking device with rectangular mating locking base; Through hole
C): -55 to 85; Generic Name: D-SUB; General Description: Receptacle; Right angle; Field-mounting locking device; PCB locking clip; MIL-C-24308
Optoelectronic 光电
|
IDEA
NEC
AME, Inc.
Sanken Electric Co., Ltd.
|
| HM365788H-5 HM365788K-9 HM365788K-5 HM365788N-9 HM |
x4 SRAM
ECU interface connectors; HRS No: 757-0010-2 00; Operating Temperature Range (degrees C): -30 to 105; General Description: Accessory; Retainer
Small automotive connectors; HRS No: 763-0095-7 00; Mating/Unmating Cycles: 30; Operating Temperature Range (degrees C): -30 to 105; General Description: Clamp x4的SRAM
|
TE Connectivity, Ltd.
|
| SJ109548 NT1R3000 |
DESCRIPTION
SPECIFICATION
|
Japan Aviation Electronics Industry, Ltd.
Japan Aviation Electronics ...
|
| 7032 |
General description
|
Taiwan Memory Technolog...
|
| I7070 |
General Description
|
Taiwan Memory Technolog...
|
| W77E058A40DL |
GENERAL DESCRIPTION
|
Nuvotem Talema
|
| KS7308 |
FCM
GENERAL DESCRIPTION
|
Samsung Electronic
Samsung semiconductor
|
| M14C32DD M14C32-DD |
M14C32 Die Description
|
SGS Thomson Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| AOK30B60D1 AOK30B60D1L |
TO247 PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
| AOI4T60 AOI4T60L |
TO251A PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductor...
|
