| PART |
Description |
Maker |
| IXFC15N80Q |
HiPerFET ISOPLUS 220 MOSFET Q-Class Electrically Isolated Back Surface
|
IXYS[IXYS Corporation]
|
| DSEP30-06CR |
HiPerDynFREDTM Epitaxial Diode with soft recovery (Electrically Isolated Back Surface) 30 A, 600 V, SILICON, RECTIFIER DIODE
|
IXYS, Corp.
IXYS[IXYS Corporation]
|
| IXFR180N085 |
Discrete MOSFETs: HiPerFET Power MOSFETS
HiPerFET-TM Power MOSFETs ISOPLUS247-TM (Electrically Isolated Back Surface)
|
IXYS Corporation
|
| IXGR24N60C |
Circular Connector; MIL SPEC:MIL-C-5015; Body Material:Metal; Series:GT; No. of Contacts:24; Connector Shell Size:24; Connecting Termination:Crimp; Circular Shell Style:Right Angle Plug; Body Style:Right Angle 42 A, 600 V, N-CHANNEL IGBT
HiPerFASTTM IGBT ISOPLUS247TM (Electrically Isolated Back Surface)
|
IXYS, Corp.
IXYS[IXYS Corporation]
|
| VS-HFA70FA120 |
Electrically isolated base plate
|
Vishay Siliconix
|
| IT210 IT215 |
ISOTAB TRIACS ELECTRICALLY ISOLATED
|
Hutson Industries
|
| IXGR40N60B |
HiPerFASTTM IGBT (Electrically Isolated Backside)
|
IXYS Corporation
|
| IXSR35N120BD1 |
IGBT with Diode ISOPLUS 247 (Electrically Isolated Backside)
|
IXYS Corporation
|
| IXFL34N100 |
HiPerFETTM Power MOSFETs ISOPLUS264(Electrically Isolated Backside)
|
IXYS Corporation
|
| MBR2X050A200 |
Electrically Isolated Base Plate
|
GeneSiC Semiconductor, ...
|
| MWDM1L-GP-0E MWDM2L-GP-0E MWDM4L-GP-0E MWDM5L-GP-0 |
Micro-D Metal Shell MWDM Back-To-Back Unshielded Cable Assemblies
|
Glenair, Inc.
|
| MSS50 MSS40 |
(MSS40 / MSS60) BACK TO BACK SCR MODULE
|
Comset Semiconductors
|
