| PART |
Description |
Maker |
| NEZHC105Z55V215X95F NEZHC104Z55V135X95F |
Memory Back-Up Capacitors
|
NIC-Components Corp.
|
| NEZB224Z55V135X75F NEZB104Z55V135X75F NEZB105Z55V2 |
Memory Back-Up Capacitors
Memory Back-Up Capacitors
|
NIC-Components Corp.
|
| MSS50 MSS40 |
(MSS40 / MSS60) BACK TO BACK SCR MODULE
|
Comset Semiconductors
|
| BZB100A |
Dual back-to-back Zener diode
|
NXP Semiconductors
|
| S10202-08 S10202-16 S10201-04 |
Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. 回到清淡TDI发动机，防治荒漠化工作的后台薄TDI的模式在防治荒漠化公约提供高灵敏度
|
Hamamatsu Photonics K.K.
|
| BR34E02FVT-3 |
Memory for Plug & Play DDR2/DDR3 SPD Memory (for Memory Modules)
|
Rohm
|
| B32333-450 |
Film Capacitors ?AC Capacitors Motor run capacitors
|
TDK Electronics
|
| M36W832TE70ZA1T M36W832TE85ZA1T M36W832TE-ZAT M36W |
SPECIALTY MEMORY CIRCUIT, PBGA66
32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
|
SGS Thomson Microelectronics
NUMONYX
意法半导
ST Microelectronics
|
| AT17LV002A AT17C002A AT17C002A-10JC AT17C002A-10JI |
FPGA Configuration EEPROM Memory 2M X 1 CONFIGURATION MEMORY, PQFP32
5015 RR 19#16 PIN PLUG 2M X 1 CONFIGURATION MEMORY, PQCC20
|
Atmel, Corp.
ATMEL[ATMEL Corporation]
|
| ADN2526 ADN2526ACPZ ADN2526ACPZ-R2 ADN2526ACPZ-R7 |
11.3 Gbps Active Back-Termination, Differential Laser Diode Driver
11.3 Gbps Active Back-Termination Differential Laser Diode Driver; Package: 16-LFCSP (3x3mm, 1.50mm exposed pad); Temperature Range: -40°C to 125°C SPECIALTY INTERFACE CIRCUIT, QCC16
|
Analog Devices, Inc.
|
