| PART |
Description |
Maker |
| 55PC1221 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC1122 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 55A0812 |
This specification sheet forms a part of the latest issue of Raychem Specification 55A.
|
TE Connectivity Ltd
|
| 749010013 744761068A |
All 16 terminals must lie on a plane within 004 of surface A after lead tinning
specification for release
specification for release
|
Wurth Elektronik GmbH & Co. KG, Germany.
Wurth Elektronik GmbH &...
|
| CMLT6427E |
ENHANCED SPECIFICATION SURFACE MOUNT, PICOmini SILICON NPN DARLINGTON TRANSISTOR
From old datasheet system
an Enhanced Specification, PICOmini™, NPN Silicon
|
CENTRAL[Central Semiconductor Corp]
Central Semiconductor Corporation
|
| SI4804BDY 72893 SI4804DY |
Dual N-Channel, 30-V (D-S) MOSFET Specification Comparison 双N沟道0 V的（副）MOSFET的规格比
Dual N-Channel/ 30-V (D-S) MOSFET Specification Comparison
|
Vishay Intertechnology, Inc.
Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
|
| MPC8308101 MPC8308 MPC8308CVMADDA MPC8308CVMAFDA M |
MPC8308 PowerQUICC II Pro Processor Hardware Specification
MPC8308 PowerQUICC II Pro Processor Hardware Specification
|
Freescale Semiconductor, Inc
|
| CL10A106MP8NNNC |
SPECIFICATION
|
Samsung semiconductor
|
| CL10B102KB8NNNC |
SPECIFICATION
|
Samsung semiconductor
|
| CL31A226KAHNNNE |
SPECIFICATION
|
Samsung semiconductor
|
| PH967C6 |
SPECIFICATION
|
ETC[ETC]
Fuji Electric
|
