PART |
Description |
Maker |
FLGA |
Fine Pitch Land Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
FLGA-SD |
Fine Pitch Land Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
5-6123466-0 |
.4mm, .5mm, .6mm, .8mm, Fine Pitch, Surface Mount, Stacking Bd-to-Bd Connectors; ON TAPING (EMBOSS) 0.5MM FS CONN. REC. A ( Tyco Electronics )
|
Tyco Electronics
|
DF21-20P-0.6SD DF21-20P-0.6SD-GND DF21-20S-0.6V DF |
CAP 0.1UF 100V 80-20% Z5U RAD.20 .20X.20 BULK ROHS-LEAD 0.6毫米间距板对细同轴电缆连接器 0.6mm Pitch Board-to-Fine-Coaxial Cable Connectors 0.6毫米间距板对细同轴电缆连接器
|
HIROSE ELECTRIC Co., Ltd. Hirose Electric USA, INC. HIROSE[Hirose Electric]
|
08-810-90 |
IC SOCK 8 PIN VERT GOLD .300 DIP8, IC SOCKET
|
Aries Electronics, Inc.
|
527248TP 527248LFP 527248NFP1 527248NCP1 527248BP |
EMI/RFI Shield Sock Backshell with Strain-Relief and 30 Cable Entries
|
Glenair, Inc.
|
319FS137XN20 319FS137XN22 319FS137XN24 319FB137XMT |
Composite Shield Sock Strain Relief Composite Shield Sock Strain Relief
|
Glenair, Inc.
|
0747121008 |
6.25mm (.246) Pitch Ganged RF Header, Vertical, 6 Circuits, Long Tails, Without Packaging Header
|
Molex Electronics Ltd.
|
0556382019 55638-2019 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, Right AngleShrouded Header with Eject Levers, 20 Circuits, Lead-free
|
Molex Electronics Ltd.
|