| PART |
Description |
Maker |
| MM3Z47VS |
Planar Die Construction
|
TY Semiconductor Co., Ltd
|
| MMBZ5228B |
Planar Die Construction
|
TY Semiconductor Co., L...
|
| MMBTA92 |
Epitaxial Planar Die Construction
|
SHIKE Electronics
|
| MMBT2369 MMBT2907 |
Epitaxial planar die construction.
Epitaxial planar die construction.
|
MAKO SEMICONDUCTOR CO.,LIMI...
MAKO SEMICONDUCTOR CO.,...
|
| 2KBP10M |
Glass Passivated Die Construction
|
Mospec Semiconductor
|
| MBR850 |
Guard Ring Die Construction for Transient Protection
|
Kersemi Electronic Co., Ltd.
Kersemi Electronic Co., Ltd...
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| GBS |
Vitreous Resistors with Corrugated Ribbon, All welded construction, High power rating up to 1000 Watt, Corrugated ribbon construction aids rapid cooling
|
Vishay
|
| TIP112F |
EPITAXIAL PLANAR NPN TRANSISTOR (MONOLITHIC CONSTRUCTION WITH BUILT IN BASE-EMITTER SHUNT RESISTORS INDUSTRIAL USE.)
|
KEC[KEC(Korea Electronics)]
|
| 1212691 |
Replacement die - CF 500/DIE RCI 6-1
|
PHOENIX CONTACT
|
