| PART |
Description |
Maker |
| HSM88AS |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| TLWK1100BT11 TLWK1100B |
Zener Diode; Application: General; Pd (mW): 200; Vz (V): 14.34 to 14.98; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MPAK
Zener Diode; Application: General; Pd (mW): 200; Vz (V): 13.84 to 14.46; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MPAK
Panel Circuit Indicator
|
Toshiba Corporation
Toshiba Semiconductor
|
| TMP47P202VP TMP47P202VM |
Zener Diode; Application: General; Pd (mW): 200; Vz (V): 2.50 to 2.75; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MPAK
Zener Diode; Application: General; Pd (mW): 200; Vz (V): 2.50 to 2.90; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK 的CMOS 4位微控制
|
Toshiba Corporation
Toshiba, Corp.
|
| TLWJ1100T11 TLWJ1100 |
Zener Diode; Application: General; Pd (mW): 200; Vz (V): 13.84 to 15.52; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MPAK
Zener Diode; Application: General; Pd (mW): 200; Vz (V): 13.37 to 13.96; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MPAK
Panel Circuit Indicator
|
Toshiba Corporation
Toshiba Semiconductor
|
| TMP86C408NG |
Zener Diode; Application: General; Pd (mW): 200; Vz (V): 22.23 to 23.17; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK
|
Toshiba Corporation
|
| TMP19A43CD |
Zener Diode; Application: General; Pd (mW): 200; Vz (V): 16.94 to 17.70; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK 32位RISC微处理器
|
Toshiba, Corp.
|
| SKDH11507 SKDH115/12 |
Transistor; Type: Amplifiers/Bipolar; VCEO (V): 5; Ic (A): 0.5; hFE: 110 to 190; fT (GHz) typ: 10.5; Cob (pF) max: 2; Package: MPAK 1200 V, SCR
Half Controlled 3-phase Bridge Rectifier
|
Semikron International
|
| HVR100 |
Small Resin Package (SRP) is suitable for surface mount design
|
TY Semiconductor Co., L...
|
| HSU277 |
Low forward resistance Ultra small Resin Package (URP) is suitable for surface mount design
|
TY Semiconductor Co., L...
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| 1SMAF4728A |
Small plastic package suitable for surface mounted design
|
SHIKE Electronics
|
