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HSM88WA - MPAK package is suitable for high density surface mounting and high speed assembly

HSM88WA_7227575.PDF Datasheet

 
Part No. HSM88WA
Description MPAK package is suitable for high density surface mounting and high speed assembly

File Size 56.08K  /  1 Page  

Maker

TY Semiconductor Co., Ltd



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(CHINA HK & SZ)
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Part: HSM88AS
Maker: 三级
Pack: SOT23
Stock: Reserved
Unit price for :
    50: $0.11
  100: $0.10
1000: $0.10

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 Full text search : MPAK package is suitable for high density surface mounting and high speed assembly
 Product Description search : MPAK package is suitable for high density surface mounting and high speed assembly


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