| PART |
Description |
Maker |
| 00175110300 |
Terminal Junctions Modules with Fast and Sealed Terminations Type 1750-1765
|
Amphenol Corporation
|
| MB6S |
GLASS PASSIVATED CHIP JUNCTIONS
|
TY Semiconductor Co., Ltd
|
| DF15005S |
Glass passivated chip junctions, Low Forward Voltage Drop, High Current Capability
|
TY Semiconductor Co., Ltd
|
| PM20CSJ060 PM400DAS060 PM100DSA120 PM300CVA060 PM3 |
IPMS Modules: 600V
MITSUBISHI INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE
IPMS Modules:1200V
50Amp - intelligent power modules
|
Mitsubishi Electric Corporation
|
| APC79102 |
POWERLINE MODULES SIMPLE?/a> Embedded PowerPacket?/a> Modules
POWERLINE MODULES SIMPLE⑩ Embedded PowerPacket⑩ Modules
|
BEL[Bel Fuse Inc.]
|
| NFM3DCC222R1H3L NFM41CC102R2A3L NFM41CC471R2A3L NF |
CAP 3 TERMINAL 2200PF 端子2200PF
CAP 3 TERMINAL 1000PF 端子1000pF
CAP 3 TERMINAL 470PF
CAP 3 TERMINAL 220PF
|
Murata Manufacturing Co., Ltd.
|
| MII300-12A4 MDI300-12A4 MID300-12A4 |
IGBT Modules: Boost Configurated IGBT Modules
IGBT Modules 330 A, 1200 V, N-CHANNEL IGBT
|
IXYS Corporation
IXYS, Corp.
|
| 19164-0042 |
Female Disconnect Solderless Terminal; Wire Size (AWG):14-16; Terminal Insulation:Niac Polymer; Contact Material:Brass; Gender:Female; Power Connection Type:Female Disconnect Solderless Terminal 2 mm2, WIRE TERMINAL
|
Molex, Inc.
|
| HYS64D16000GDL-8-B HYS64D16000GDL-6-B HYS64D16000G |
DDR SDRAM Modules - 256MB (32Mx64) PC3200 2-bank
DDR SDRAM Modules - 128MB (16Mx64) PC2700 1-bank
DDR SDRAM Modules - 128MB (16Mx64) PC2100 1-bank
DDR SDRAM Modules - 256MB (32Mx64) PC2100 2-bank
200-Pin Small Outline Dual-In-Line Memory Modules
|
INFINEON[Infineon Technologies AG]
|
| VBO65-12NO7 VBO65-16NO7 VBO65-08NO7 VBO65-14NO7 VB |
Power Modules/Rectifier Bridge Modules: Single Phase Diode Bridges
|
IXYS
|
| VBO36-12NO8 VBO36-08NO8 VBO36-16NO8 VBO36-18NO8 VB |
Power Modules/Rectifier Bridge Modules: Single Phase Diode Bridges
|
IXYS
|
