| PART |
Description |
Maker |
| MX23C6411RC-12 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘（掩模可编程
|
Macronix International Co., Ltd.
|
| HN62V454BCP-20 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘（掩模可编程
|
TE Connectivity, Ltd.
|
| UPD23C32000AGY-XXX-MJH UPD23C32000AGY-XXX-MKH UPD2 |
x8 or x16 ROM (Mask Programmable)
HITFET, TEMPFET - Smart Low-Side Switches x8或x16光盘（掩模可编程
|
NEC, Corp.
|
| UPD23C8000LGY-XXX-MKH UPD23C8000LGY-XXX-MJH UPD23C |
x8 or x16 ROM (Mask Programmable)
EPIC™ - PEF 2055
IGBT Modules up to 1200V FourPACK x8或x16光盘（掩模可编程
ELIC - PEF 20550 x8或x16光盘（掩模可编程
|
NEC, Corp.
Unisonic Technologies Co., Ltd.
|
| UPD23C1000A |
Mask Programmable CMOS ROM
|
NEC Electronics
|
| UPD23C1001E |
Mask Programmable CMOS ROM
|
NEC Electronics
|
| GM23C8000-20 GM23C8000FW-20 |
x8 ROM (Mask Programmable) x8光盘（掩模可编程
|
TE Connectivity, Ltd.
Harwin PLC
|
| AM27X64-105XC AM27X64-120XC AM27X64-250XC AM27X64- |
x8 ROM (Mask Programmable) x8光盘（掩模可编程
|
Advanced Micro Devices, Inc.
|
| 2332-3CK 2332-4CJ 2332-3CJ 2332-4CK |
x8 ROM (Mask Programmable) x8光盘（掩模可编程
|
SEMIKRON
Won-Top Electronics Co., Ltd.
|
| AM27X512-70EI AM27X512-200EI |
x8 ROM (Mask Programmable) x8光盘（掩模可编程
|
Rochester Electronics, LLC
|
