| PART |
Description |
Maker |
| I3504-6HMT3224B |
PRODUCT SPECIFICATIO FOR TFT LCM
|
ILLUMINANT CO., LTD
|
| SE7210TP1-E |
Intel庐 Server Board Technical Product Specification
Intel? Server Board Technical Product Specification
|
Intel Corporation
|
| DQ965CO D56019-001US |
Technical Product Specification
|
Intel Corporation
|
| D845GEBV2 |
Technical Product Specification
|
Intel
|
| D56026-001US D946GZTS |
Technical Product Specification
|
Intel Corporation
|
| D14070-001US D945GTP |
Technical Product Specification
|
Intel Corporation
|
| C68600-002 D915GAG D915GAV |
Intel Desktop Boards Technical Product Specification
|
Intel Corporation
|
| DBMC-13X3SJ-K126 |
Brand: Cannon Product Category: D Sub Product Line: D Sub Series: COMBO D
|
List of Unclassifed Manufacturers
|
| XC95288-15BG352C XC95288-20BGG352I XC95288-10BGG35 |
288 MACROCELL 5 VOLT ISP CPLD - NOT RECOMMENDED for NEW DESIGN FLASH PLD, 15 ns, PBGA352
XC95288-20BGG352I - NEW PRODUCT FLASH PLD, 20 ns, PBGA352
XC95288-10BGG352C - NEW PRODUCT
FLASH PLD, 20 ns, PQFP208
|
Xilinx, Inc.
XILINX INC
|
| S75WS256NDFBFWLJ3 S75WS256NDFBAWLK2 S75WS256NDFBFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
Spansion, Inc.
SPANSION LLC
|
| S71WS-N S71WS512NB0BFWYP3 S71WS512NB0BAWAP3 S71WS5 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
