PART |
Description |
Maker |
9-0744506-3 C-1-528041-5 |
DIE SET SHIELD CRIMP)HVP800 90DEG. 25 SQMM
|
TE Connectivity Ltd
|
0690081119 |
Die Set for 690081114, Modular Plug, FFC 68, 6/6 Circuit, Short Body
|
Molex Electronics Ltd.
|
TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
1061149000 |
MPO Swivel EMI Adapter, Simplex, Singlemode or Multimode, Die-Cast, Set Screw
|
Molex Electronics Ltd.
|
P420001 |
RJ11 Straight Through Modular In-Line Coupler (F-F)
|
Tripp Lite. All Rights ...
|
1PK-212 8PK-SD009 |
TWIN WRENCH DRIVER SET "HEX BIT SET 1/4"" SECURITY 34 PIECE “六角位设置1 / 4”,“安4海贼王
|
Jameco Electronics
|
TLP604TEL |
6-outlets, 4-ft cord, 790 joule strip, RJ11 protection - Protect It! Surge Suppressor
|
List of Unclassifed Man...
|
STI5206 STI5206ZYB |
Low-cost SD advanced decoder SoC for set-top boxes Advanced SD decoder for set-top box applications
|
ST Microelectronics STMicroelectronics
|
STI5514 STI5514AWC STI5514BWC STI5514-DVB STI5514D |
Set-top box decoder with hard disk drive capability for digital TV / digital set-top box or cable box Set-top box decoder with hard disk drive capability for digital TV, digital set-top box or cable box Set-top box decoder with hard disk drive capability for digital TV, digital set-top box or cable box Set-top box decoder with hard disk drive capability for digital TV digital set-top box or cable box Set-top box decoder with hard disk drive capability for digital TV, digital set-top box or cable box STi5514 data brief
|
意法半导 STMICROELECTRONICS[STMicroelectronics] ST Microelectronics
|
BA8206 BA8206F A5800623 BA8206/F |
Tone Ringer IC for Telephone Set(?佃??虹???????) Communications LSIs > ICs for telephone > Tone ringer From old datasheet system Tone Ringer IC for Telephone Set(电话机的响铃芯片)
|
ROHM[Rohm] Rohm CO.,LTD.
|
MR18R162GAF0 MR16R162GAF0 MR18R1624AF0 MR18R1622AF |
64M X 16 RAMBUS MODULE, DMA184 TVS 500W 6.5V BIDIRECT DO-15 6Mx16显示)2/8/16)件RIMM的模块,基于256Mb阿芯片,32秒银行,16K/32ms参考,.5V 16Mx16显示)2/8/16)件RIMM的模块,基于256Mb阿芯片,32秒银行,16K/32ms参考,.5V (MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
|
Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor]
|
SIDC02D60SIC2SAWN SIDC02D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 6A die sawn Diodes - HV Chips - 600V, 6A die unsawn
|
Infineon
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