| PART |
Description |
Maker |
| 43045-0213 43045-0214 43045-0212 430450212 43045-1 |
MICRO FIT (3.0) DUAL ROW VERTICAL THRU HOLE HEADER ASSY
|
Molex Electronics Ltd.
|
| 2-1445054-3 2-1445054-4 2-1445054-2 2-1445054-5 |
RIGHT ANGLE THRU HOLE HEADER ASSY, TIN CONTACTS W/THRU HOLE HOLDDOWNS, SINGLE ROW, MICRO MATE-N-LOK
RIGHT ANGLE THRU HOLD HEADER ASSY, TIN CONTACTS W/THRU HOLE HOLDDOWNS, SINGLE ROW, MICRO MATE-N-LOK
|
Tyco Electronics
|
| 4-103240-0-03 4-103240-0-16 |
HEADER ASSY, MOD II, BREAKAWAY, DOUBLE ROW, .100X.100CL, VERTICAL, WITH .025 SQ POSTS
HEADER ASSY, MOD II, BREAKAWAY, DOUBLE ROW, .100X.100CL, VERTICAL,WITH .025 SQ POSTS
|
Tyco Electronics
|
| 6-104362-0 5-104362-4 5-104362-6 5-104362-8 5-1043 |
HEADER ASSY, AMPMODU MTE, VERTICAL SINGLE ROW, .100 C/L, .025 SQ POST POLARIZED, WITH LATCHING & HOLD DOWN
HEADER ASSY, AMPMODU MTE, VERTICAL SINGLE ROW, .100 C/L, .025 SQ POST POLARIZED, WITH LATCHING & HOLD DOWN
|
Tyco Electronics
|
| 2-1445053-2 2-1445053-9 |
VERTICAL SURFACE MOUNT HEADER ASSY TIN CONTACTS, SURF MOUNT HOLDDOWNS, SINGLE ROW, MICRO MATE-N-LOK
VERTICAL SURFACE MOUNT HEADER ASSY, TIN CONTACTS, SURF MOUNT HOLDDOWNS, SINGLE ROW, MICRO MATE-N-LOK
|
Tyco Electronics
|
| 87891-2817 0878912817 |
2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50渭m (100渭 Tape on Reel Packaging, Lead-free
2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50μm (100μ Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 15-47-7512 0015477512 A-70568-0004 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits
|
Molex Electronics Ltd.
|
| 15-80-0081 A-70567-0002 0015800081 705670002 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0141 A-70567-0005 0015800141 705670005 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0065 0015800065 70567-0137 A-70567-0137 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0129 0015800129 A-70567-0276 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
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