| PART |
Description |
Maker |
| 1FHAX720-737G FHAX937-737G 2FJA168-736G FGA596-720 |
720 POS 1MM BGA SMT ADAPTER BGA720, IC SOCKET
937 POS 1MM BGA SMT ADAPTER BGA937, IC SOCKET
168 POS 0.80MM PITCH BGA SMT ADAPTER BGA168, IC SOCKET
596 POS 1.27MM BGA SMT ADAPTER BGA596, IC SOCKET
1020 POS 1MM BGA SMT ADAPTER BGA1020, IC SOCKET
860 POS 1MM BGA SMT ADAPTER BGA860, IC SOCKET
225 POS 1MM BGA SMT ADAPTER BGA225, IC SOCKET
388 POS 1MM BGA SMT ADAPTER BGA388, IC SOCKET
480 POS 1.27MM BGA SMT ADAPTER BGA480, IC SOCKET
324 POS 1MM BGA SMT ADAPTER BGA324, IC SOCKET
560 POS 1MM BGA SMT ADAPTER BGA560, IC SOCKET
BGA1036, IC SOCKET
256 POS 1.27MM BGA SMT ADAPTER
BGA320, IC SOCKET
BGA328, IC SOCKET
BGA132, IC SOCKET
BGA241, IC SOCKET
BGA255, IC SOCKET
BGA208, IC SOCKET
BGA272, IC SOCKET
BGA233, IC SOCKET
384 POS 1MM BGA SMT ADAPTER
225 POS 1.27MM BGA EXTRACTION ADAPTER
BGA696, IC SOCKET
BGA957, IC SOCKET
BGA824, IC SOCKET
BGA644, IC SOCKET
BGA352, IC SOCKET
BGA784, IC SOCKET
BGA788, IC SOCKET
BGA416, IC SOCKET
|
Advanced Interconnections, Corp.
ADVANCED INTERCONNECTIONS CORP
|
| TSC607-ZPPACKOF10 TSC506-ZP |
IC FLEX 10KE FPGA 200K 600-BGA
780-pin FineLine BGA BEFESTIGUNGSKLAMMER多珀0ST
|
OSRAM GmbH
|
| 3-1640240-4 |
Matrix Series Ball Grid Array ( BGA ) Sockets; 2401 POSITION BGA SOCKET ASSEM ( Tyco Electronics )
|
Tyco Electronics
|
| ELANSC520-100AC ELANSC520-100AI |
PLASTIC BGA, CAVITY UP(BGA)
|
ADVANCED MICRO DEVICES INC
|
| IS61NVF102418-6.5B2 IS61NVF25672-6.5B1 IS61NVF5123 |
1M X 18 ZBT SRAM, 6.5 ns, PBGA119 14 X 22 MM, PLASTIC, BGA-119
256K X 72 ZBT SRAM, 6.5 ns, PBGA209 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-209
512K X 36 ZBT SRAM, 6.5 ns, PBGA119 14 X 22 MM, PLASTIC, BGA-119
256K X 72 ZBT SRAM, 7.5 ns, PBGA209
|
Integrated Silicon Solution, Inc.
INTEGRATED SILICON SOLUTION INC
|
| IBM25PPC740-DB0M2660 IBM25PPC740-EB0M2660 IBM25PPC |
32-BIT, 266 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
32-BIT, 233 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
32-BIT, 200 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
32-BIT, 300 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
|
Japan Aviation Electronics Industry, Ltd.
|
| EWIXP465AB EWIXP455AD EWIXP455ACT EWIXP455ADT EWIX |
266 MHz, RISC PROCESSOR, PBGA544 LEAD FREE, PLASTIC, BGA-544
533 MHz, RISC PROCESSOR, PBGA544 LEAD FREE, PLASTIC, BGA-544
400 MHz, RISC PROCESSOR, PBGA544 LEAD FREE, PLASTIC, BGA-544
667 MHz, RISC PROCESSOR, PBGA544 LEAD FREE, PLASTIC, BGA-544
|
Intel, Corp.
INTEL CORP
|
| FDZ294N |
N-Channel 2.5V Specified PowerTrench® BGA MOSFET
N-CHANNEL 2.5 V SPECIFIED POWERTRENCH BGA MOSFET
|
Fairchild Semiconductor
|
| EPM7512AEBC256-10 EPM7256AEFC100-10 |
COMPLEX-EEPLD,512-CELL,10NS PROP DELAY,BGA,256PIN,PLASTIC
COMPLEX-EEPLD,256-CELL,10NS PROP DELAY,BGA,100PIN,PLASTIC
|
Altera Corp
|
| K7P401822B-HC16 K7P401822B-HC20 K7P401822B-HC25 K7 |
SENSOR DIFF VACUUM GAGE 10 H2O 128K × 36
128Kx36 & 256Kx18 Synchronous Pipelined SRAM 128K × 36
256K X 18 STANDARD SRAM, 2.7 ns, PBGA119 14 X 22 MM, BGA-119
128K X 36 STANDARD SRAM, 2.7 ns, PBGA119 14 X 22 MM, BGA-119
256K X 18 STANDARD SRAM, 3 ns, PBGA119 14 X 22 MM, BGA-119
SENSOR DIFF VACUUM GAGE 1PSI
SENSOR ABSOLUTE 0-15PSIA
128Kx36 & 256Kx18 Synchronous Pipelined SRAM
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| GS8322Z72C-225T GS8322Z72GC-225T GS8322Z18B-225IT |
512K X 72 ZBT SRAM, 7 ns, PBGA209 14 X 22 MM, 1 MM PITCH, BGA-209
512K X 72 ZBT SRAM, 7 ns, PBGA209 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209
2M X 18 ZBT SRAM, 7 ns, PBGA119
|
GSI Technology, Inc.
|
| S587-10-272-10-005437 |
272 BGA ADAPTER
|
Actel Corporation
|
|
