| PART |
Description |
Maker |
| DB3X207K |
DB3X207K0L Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
|
Panasonic Battery Group
|
| CMR200T CMR200T1 CMR250T |
LEAD FORMED SMD TYPE WITH EMBOSSED TAPE
|
List of Unclassifed Manufacturers
ETC
|
| DB2430100L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
| DB2460500L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Semiconductor
|
| DB2130200L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
| 502494-1270 502494-1370 502494-0470 502494-0870 50 |
EMBOSSED TAPE PACKAGE FOR 502494
|
Molex Electronics Ltd.
|
| PMK325AC6227MM-P |
Standard packaging quantity (minimum) Taping Embossed 1000pcs
|
Taiyo Yuden (U.S.A.), I...
|
| 67492-1820 |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height5.60mm (.220"), Gold (Au) Flash, without Cap, Embossed Tape on Reel Packaging, 2
1.27mm (.050) Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height5.60mm (.220), Gold (Au) Flash, without Cap, Embossed Tape on Reel Packaging, 22Circuits, Lead Free
|
Molex Electronics Ltd.
|
| 0791098655 |
2.00mm (.079) Pitch Milli-Grid?/a> Receptacle, Surface Mount, Vertical, Top/Bottom Entry, with Press-fit Plastic Pegs, with Cap, Embossed Tape on Reel
|
Molex Electronics Ltd.
|
| 71439-1464 |
1.00mm (.039) Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Embossed Tape on Reel, 0.76μm (30μ) Gold (Au), 64 Circuits Pick
|
Molex Electronics Ltd.
|
| 0791098601 |
2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Vertical, Top/Bottom Entry, with Press-fit Plastic Pegs, with Cap, Embossed Tape on Reel
|
Molex Electronics Ltd.
|
| 0791098455 |
2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Vertical, Top/Bottom Entry, without Press-fit Plastic Pegs, with Cap, Embossed Tape on Reel
|
Molex Electronics Ltd.
|
|
