| PART |
Description |
Maker |
| LSSHS-6-D |
.050*.100 cl Dual Row - Straight Low Profile Socket Strips
|
Major League Electronics
|
| BSTCM-6-DV |
.050*.100 cl Dual Row - Surface Mount - Vertical Board Stacker Terminal Strip Headers
|
Major League Electronics
|
| BSTCM-5-DV |
.050*.050 cl Dual Row - Surface Mount Board Stacker Termianl Strips
|
Major League Electronics
|
| TSHS-5-D |
.050x.050 cl Dual Row - Straight Terminal Strip Headers
|
Major League Electronics
|
| PSSHSM-5-DV |
.050x.050 cl Dual Row - Surface Mount Polarized Shrouded Socket
|
Major League Electronics
|
| A-70280-0115 0010897720 010-89-7720 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 72 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row
|
Molex Electronics Ltd.
|
| 530336-2 |
.050, .075, .100 Box Connectors; 2 ROW BOX PIN 40 POS R/A ( AMP )
|
Tyco Electronics
|
| 70280-0068 A-70280-0068 0010897562 010-89-7562 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
|
