| PART |
Description |
Maker |
| 940 |
ECHOTEL?CONTACTULTRASOUND
|
Magnetrol International, Inc.
|
| PEH506 |
IEC 60384-4 Long Life Grade 40/85/56, in accordance with CECC 30 301-809
|
Kemet Corporation
|
| MA4E2513L-1289 |
SURMOUNTTM Low Barrier Tee ?301 Footprint Silicon Schottky Diodes
|
M/A-COM Technology Solutions, Inc.
|
| PEH532 |
IEC 60384-4 Long Life Grade 40/105/56, in accordance with CECC 30 301-809
|
Kemet Corporation
|
| PEH534 |
IEC 60384-4 Long Life Grade 40/105/56, in accordance with CECC 30 301-809
|
Kemet Corporation
|
| 0040062014 040-06-2014 42172AA1 |
Panel Grounding Clip Crimp Terminal 42172, 14 AWG, 301 Stainless Steel, 0.89mm (.035) Panel Thickness
Panel Grounding Clip Crimp Terminal 42172, 14 AWG, 301 Stainless Steel, 0.89mm (.035") Panel Thickness
MOLEX Connector
|
Molex Electronics Ltd.
|
| XR-4880 |
AEP Model UK Model
|
SONY[Sony Corporation]
|
| DQS-30-450 |
90o HYBRID MODEL
90ì HYBRID MODEL
|
SYNERGY MICROWAVE CORPORATION
|
| MP02HBT190-08 MP02HBT190-10 MP02HBT190-12 |
300 A, 800 V, SCR
300 A, 1000 V, SCR
300 A, 1200 V, SCR
|
DYNEX SEMICONDUCTOR LTD
|
