| PART |
Description |
Maker |
| AC10FSMA AC10DSMA |
10 A RESIN INSULATION TYPE TRIAC 10阿树脂绝缘型可控
10A resin insulated TRIAC
|
NEC, Corp.
NEC[NEC]
|
| PC314 PC3Q14 PC3D14 |
OPAQUE MINI-FLAT PACKAGE/ AC INPUT TYPE PHOTOCOUPLER
OPAQUE MINI-FLAT PACKAGE, AC INPUT TYPE PHOTOCOUPLER
|
Sharp Corporation
SHARP[Sharp Electrionic Components]
|
| DDY-EJE-UV2-1 DDY-EJE-U2 DDY-EJE-T2 DDY-EJE-V1 |
LED Colored Resin SINGLE COLOR LED, YELLOW
LED Colored Resin 的LED彩色树脂
|
DOMINANT Opto Technologies Sdn Bhd.
DOMINANT Opto Technologies Sdn. Bhd.
|
| GL538 GL537 |
Emitting Diode 5mm Resin Mold Type Infrared
From old datasheet system
フ 5mm Resin Mold Type Infrared Emitting Diode
Φ 5mm Resin Mold Type Infrared Emitting Diode
|
SHARP[Sharp Electrionic Components]
|
| CONT-GTC16S-A528 031-50600-002 |
CLIP - SYNTHETIC RESIN
|
Japan Aviation Electronics Industry, Ltd.
|
| EALP03SXAOA0-AM |
Colorless clear resin.
|
Everlight Electronics C...
|
| EALP03SXAYA0-AM |
Colorless clear resin.
|
Everlight Electronics C...
|
| FO-EX-SCAD1-001 FO-EX-SCAD1-002 FO-EX-SCAD1-003 FO |
FRONT HOUSING SYNTHETIC RESIN
|
Japan Aviation Electronics Industry, Ltd.
JAE Electronics, Inc.
|
| FQ1045AR-6.000 FQ1045A-6.000 |
Resin Sealed SMD Crystal
|
Fox Electronics
|
| L4100 |
Resin-potted metal package LED
Resin-potted metal package LED 树脂盆栽金属封装的LED
|
HAMAMATSU[Hamamatsu Corporation]
Hamamatsu Photonics K.K.
|
