| PART |
Description |
Maker |
| 21-0664 |
PACKAGE OUTLINE 12L TDFN, 3*3*0.75MM
|
Maxim Integrated Products
|
| AAT3696 |
1.6A Li-Ion Battery Charger in a 3x3 TDFN Package
|
Skyworks Solutions Inc.
|
| MAX34565 |
12V Hot-Plug Switch in TDFN Package
|
Maxim Integrated Products
|
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| SSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSOT23-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSOT23-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
