| PART |
Description |
Maker |
| TC2591 |
1 W Flange Ceramic Packaged PHEMT GaAs Power FETs
|
Transcom, Inc.
|
| TC2997B |
1.9 GHz 20 W Flange Ceramic Packaged GaAs Power FETs
|
Transcom, Inc.
|
| LT3P31W |
┆3mm(T-1), Cylinder Type(Thick Flange), Colored Diffusion, Tape-packaged LED Lamps for Surface Mount
|
SHARP[Sharp Electrionic Components]
|
| CLA4601-203 CLA4604-203 CLA4604-219 CLA4602-219 CL |
Silicon Limiter Diodes, Ceramic Hermetic Packaged and Bondable Chips
|
Skyworks Solutions
|
| TGA8658-EPU-SG |
Packaged Ku-band HPA
Ku Band 2W Packaged Amplifier
|
TRIQUINT[TriQuint Semiconductor]
|
| TGB2010-EPU-SM TGB2010-00-EPU-SM TGB2010-50-EPU-SM |
5 - 9 GHz packaged Bessel filter
5GHz - 9GHz Packaged Bessel Filter
|
TRIQUINT[TriQuint Semiconductor]
|
| D20NP1R4F5PA D12NP0R4F5PA D12NP0R4B5PA D15NP1R2F5P |
CAPACITOR, CERAMIC, 50 V, NP, 0.0000014 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000004 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000012 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000005 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000024 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000006 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000018 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000024 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000008 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000009 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.00000045 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000014 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000012 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000011 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000013 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.000001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000007 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000011 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.00000035 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000017 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000016 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NS, 0.000002 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, BJ, 0.000043 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, PG, 0.00000008 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PG, 0.00000008 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PG, 0.00000007 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, PG, 0.00000007 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PI, 0.0000002 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PI, 0.00000006 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, PI, 0.00000006 uF, SURFACE MOUNT CHIP
|
Dielectric Laboratories, Inc.
|
| PB-CMM0511-QT-0000 CMM0511-QT-0G0T CMM0511-QT-0G00 |
5.0-14.0 GHz GaAs MMIC Packaged Driver Amplifier 5.0-14.0 GHz的砷化镓微波单片集成电路封装驱动放大
5.0-14.0 GHz GaAs MMIC Packaged Driver Amplifier 5000 MHz - 14000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
|
Mimix Broadband, Inc.
ATM Electronic, Corp.
|
| PS7841C-A11 PS7841C-A15 |
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21366 packaged in a Lead-Free 28-Lead SOIC
Single Low Side Driver, Current Limiting, Programmable Shutdown Error Pin in a 8-pin DIP package; A IR2121 packaged in a Lead-Free 8-Lead PDIP
|
NEC, Corp.
|
| AM29707DC AM29707LC AM29707PC AM29705/BXA AM29705A |
Dual Low Side Driver in a 8-pin DIP package; A IR4427 packaged in a 8-Lead PDIP
High and Low Side Driver, SoftTurn-On, Noninverting Inputs, Separate High and Low Side Inputs in a 8-pin DIP package; A IR2181 packaged in a Lead-Free 8-Lead SOIC
Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, All high Voltage Pins on One Side, Programmable 540-5000ns Deadtime in a 14-pin DIP package; A IRS21094 packaged in a Lead-Free 14-Lead SOIC
High voltage, high speed power MOSFET and IGBT driver with dependent high side and low side referenced output channels packaged in a 8-Pin SOIC; A IRS2609DSPBF with Standard Packaging
x4 SRAM
Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, All high Voltage Pins on One Side, Programmable 540-5000ns Deadtime in a 14-pin DIP package; A IRS21094 packaged in a Lead-Free 14-Lead PDIP
High and Low Side Driver, SoftTurn-On, Noninverting Inputs, Separate High and Low Side Inputs in a 8-pin DIP package; A IR2181 packaged in a 8-Lead SOIC
x4SRAM
|
|
| LSP1004 LSP1011 LSP1000 LSP1012 LSP1002 LSP1004-35 |
35 V, SILICON, PIN DIODE
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES 增强性能表面贴装绕流封装器件
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES
|
MICROSEMI CORP-LOWELL
Microsemi, Corp.
MICROSEMI[Microsemi Corporation]
|
|
