| PART |
Description |
Maker |
| KX1400 KX1400DK-EVK KX1400EG-11Z |
Description KX1400 Audio Playback IC
|
Conexant Systems, Inc
|
| HM5164400LJ-5 HM5165400LJ-5 HM5165400J-5 HM5164400 |
IEC 61754-6; HRS No: 710-0087-3 40; Mating/Unmating Cycles: 500; Operating Temperature Range (degrees C): -25 to 70; Generic Name: MU; General Description: Cap
IEC 61754-6; HRS No: 710-0076-7 00; Insertion Loss (dB): 0.5; Return Loss (dB)(Min.): 40; Generic Name: MU; General Description: Plug insertion/extraction tool
x4 Fast Page Mode DRAM x4快速页面模式的DRAM
|
3M Company
|
| FCPF11N60T |
General Description
|
Fairchild Semiconductor
|
| 8XC251SA 8XC251TA1 |
Hardware Description
|
Intel Corporation
|
| AOWF12N60 AOWF12N60L |
Marking Description
|
Alpha & Omega Semiconductors
|
| 8XC251TP 8XC251SP 8XC251TA 8XC251SB 8XC251SQ 8XC25 |
Hardware Description
|
Intel Corporation
|
| KA7307D |
GENERAL DESCRIPTION
|
Samsung semiconductor
|
| I7070 |
General Description
|
Taiwan Memory Technolog...
|
| AT73C213 |
The AT73C213 is a fully integrated, low-cost combined stereo audio DAC and audio amplifier circuit targeted for Li-ion or Ni-Mh battery-powered ...
Power Management for Mobiles (PM) / Audio Interface for Portable Handsets
|
ATMEL[ATMEL Corporation]
|
| TMS27PC512-12DDE TMS27PC512-12DDE4 TMS27PC512-10DU |
PLCC Clip-on Adapters; Top Pin Count: 32; Bottom Pin Count: 32; Part Description: PLCC IC Clip;
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.5; IC Size X (mm): 4; IC Size Y (mm): 4; Socket Lid: Swivel; Max Pincount: 20; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.65; IC Size X (mm): 6; IC Size Y (mm): 6; Socket Lid: Swivel; Max Pincount: 28; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
x8 EPROM x8存储
FPGA Development: XILINX; Top Pin Count: 84; Bottom Pin Count: 84; Top Interface: PLCC SOCKET; Bottom Interface: PLCC PLUG; Device Specific: yes; Devices Supported: XC3020, 3030, 3042; Part Description: Xilinx FPGA adapter; x8存储
|
Maxim Integrated Products, Inc.
Clare, Inc.
TE Connectivity, Ltd.
|
