PART |
Description |
Maker |
CYV15G0403DXB CYP15G0403DXB-BGC CYV15G0403DXB-BGI |
Physical Layer Devices : Video (SMPTE) PHYs Physical Layer Devices : Multi-Protocol PHYs Independent clock quad HOTLink II transceiver. Speed standard.
|
Cypress
|
CI201210-6N8J CI201210-5N6D CI201210-4N7D CI201210 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc. Bourns, Inc.
|
CI160808-1N0D CI160808-1N2D CI160808-1N5D CI160808 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.15 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc. Bourns, Inc.
|
2512069007Y0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp.
|
CL31C332FBFNNNE |
Multi-layer Ceramic Capacitor
|
Samsung semiconductor
|
DA01 |
CERAMIC MULTI-LAYER AXIAL
|
Dubilier
|
2508053017Y0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp...
|
2506033007Y0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp.
|
251R15S3R3CV4E |
MULTI-LAYER HIGH-Q CAPACITORS
|
Johanson Technology Inc.
|
35ST474MA13216 |
POLYMER MULTI-LAYER CAPACITORS
|
RUBYCON CORPORATION
|
2512061527Y0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp.
|
|