| PART |
Description |
Maker |
| 081029132723 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 081029132636 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 081029132611 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| SES3V3D923-2U |
Small Body Outline Dimensions
|
Surge Components
|
| TO247 TO247AC TO247C |
HEXFET TO-247AC Outline Dimensions are shown in millimeters (inches)
|
Electronic Theatre Controls, Inc.
ETC[ETC]
List of Unclassifed Manufacturers
|
| TO247 TO247AC TO247C |
HEXFET TO-247AC Outline Dimensions are shown in millimeters (inches)
|
International Rectifier
|
| SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| SSOP-24 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN7X7-48 |
Package Outline
|
Global Mixed-mode Techn...
|
| TO252-5 |
Package Outline
|
Global Mixed-mode Techn...
|
