PART |
Description |
Maker |
90-0096 |
PACKAGE LAND PATTERN, (S8) 0.150 SOIC, 8 LEADS
|
Maxim Integrated Products
|
90-0097 |
PACKAGE LAND PATTERN, (S16) 0.150 SOIC, 16 LEADS
|
Maxim Integrated Products
|
90-0107 |
PACKAGE LAND PATTERN, (216) 0.300 SOIC, 16 LEADS
|
Maxim Integrated Products
|
90-0121 |
PACKAGE LAND PATTERN, (T1655-4 / T1655 4)
|
Maxim Integrated Products
|
90-0021 |
PACKAGE LAND PATTERN, (T2444-3 / T2444 3)
|
Maxim Integrated Products
|
90-0002 |
PACKAGE LAND PATTERN, (T4055-2 / T4055 2)
|
Maxim Integrated Products
|
90-0120 |
PACKAGE LAND PATTERN, (U16E-3 / U16E 3)
|
Maxim Integrated Products
|
LPF1245T-100M LPF1245T-150M LPF1245T-1R5M LPF1245T |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
LPF2005T-4R7M LPF2005T-3R3M |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
LPF3510T-6R8M LPF3510T-470M LPF3510T-2R2M LPF3510T |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
LPS181214T-2R2M LPS181214T-3R3M LPS181214T-4R7M LP |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|