| PART |
Description |
Maker |
| 21-0137 |
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM
|
Maxim Integrated Products
|
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| OMA541SFB 5962-94520 OMA541SA OMA541SF |
Single Hi-Rel Operational Amplifier in a F-14L package
Single Hi-Rel Operational Amplifier in a F-8B package
Monolithic Operational Amplifier In Isolated Flat Packs
From old datasheet system
|
Electronic Theatre Controls, Inc.
International Rectifier
ETC[ETC]
List of Unclassifed Manufacturers
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| SOT527-1 |
Package outline
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| SOT684-2 |
Package outline
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| SOT23-3 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT23-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP2X2-4 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN7X7-44 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP8X8-64 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP8X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
