| PART |
Description |
Maker |
| 121-29293-01 121-29293-01-260 121-29293-02 121-292 |
POWER BUSS STRIPS 100 x 300 GRID
|
Winchester Electronics Corporation
|
| 2329-2-00-44-00-00-07-0 2329-2-00-50-00-00-07-0 |
BRASS, SILVER (300) OVER COPPER FINISH, PCB TERMINAL
BRASS, TIN LEAD (300) FINISH, PCB TERMINAL
|
MILL-MAX MFG CORP
|
| A-7859-2561 7859-2561N 15-29-1026 0015291026 |
2.54mm (.100) Pitch C-Grid? Shunt Terminal Housings, (30μ) Gold (Au), 2 Circuits, with Pin Stop
2.54mm (.100") Pitch C-Grid庐 Shunt Terminal Housings, (30渭") Gold (Au), 2 Circuits, with Pin Stop
2.54mm (.100") Pitch C-Grid垄莽 Shunt Terminal Housings, (30楼矛") Gold (Au), 2 Circuits, with Pin Stop
|
Molex Electronics Ltd.
|
| 15-38-1024 0015381024 |
2.54mm (.100") Pitch C-Grid庐 Shunt Terminal Housings, All Over Tin (Sn), 2 Circuits, with Open End
2.54mm (.100) Pitch C-Grid? Shunt Terminal Housings, All Over Tin (Sn), 2 Circuits, with Open End
|
Molex Electronics Ltd.
|
| PPF75N10N |
N Channel MOSFET; Package: TO-258; ID (A): 50; RDS(on) (Ohms): 0.025; PD (W): 300; BVDSS (V): 100; Rq: 0.42; 50 A, 100 V, 0.025 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-258AA
|
Microsemi, Corp.
|
| 87663-9006 |
Description: 6.35mm (.250) Pitch Power (DC), 7.62mm (.300) Pitch Power (AC), 2.54mm (.100)Pitch Signal, EXTreme PowerPlus Board-to-BoardHeader, Through Hole, Right
|
Molex Electronics Ltd.
|
| APT30M40B2VR APT30M40LVR APT30M40LVRG |
Power MOSFET; Package: TO-264 [L]; ID (A): 76; RDS(on) (Ohms): 0.04; BVDSS (V): 300; 76 A, 300 V, 0.04 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-264AA
POWER MOS V 300V 76A 0.040 Ohm
|
Microsemi, Corp.
Advanced Power Technology
|
| 87663-9005 |
6.35mm (.250) Pitch Power (DC), 7.62mm (.300) Pitch Power (AC), 2.54mm (.100) Pitch Signal
|
Molex Electronics Ltd.
|
| PL342 PL34120191000GDDC PL34120191000KKEX PL341201 |
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±14; Dark
Infrared Light Emitting Diodes Top View Type; Type: Surface Mount Type (Sideview); Peak light emitting wavelength P (nm): 950; Half viewing angle
Infrared Light Emitting Diodes Top View Type; Type: Sideview Resin; Peak light emitting wavelength P (nm): 950; Half viewing angle 1/2 (deg): ±
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±32; Dark
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 3.0x2.5(t=2.5); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 1;
Schottky Barrier Diodes; Package: TO220FN; Constitution materials list: Packing style: Bulk; Package quantity: 500;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 81.3; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 2.6x1.6(t=0.8); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 0.7;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 1.9x1.3(t=0.6); Number of terminal: 2; Reverse voltage VR(V): 100; Average rectified forward current IO(A): 0.5;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
High Sensitivity Chip Sensors Sideview Type; Type: Surface Mount Type; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±12; Dark current ICEO (Max.)(µA): 0.5; Response time tr·tf (µA): 10; Yes;
Reflective Type Photosensors (Photoreflectors); Type: Cased Type; Light Emitting Diode: 630; Phototransistor: 600; Collector current IC (Min.)(mA): 0.08; Response time tr·tf (µs): 10;
Photointerrupter General Type; Packing style: Plastic bag; Package quantity: 400; 塑料无引线芯片载
Plastic Leadless Chip Carrier 塑料无引线芯片载
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 80; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24; 塑料无引线芯片载
Lead Frame Remote Control Receiver Modules (5V Type); Packing style: Stick; Package quantity: 1000; 塑料无引线芯片载
660/780nm Dual Wave Low Power Lasers; Packing style: Tray; Package quantity: 500; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 400; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 5.5x6.5(t=2.3); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 6;
|
Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
|
| 70287-1195 |
2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 100 Circuits, 8.13mm
|
Molex Electronics Ltd.
|
|
