PART |
Description |
Maker |
JYC0195 |
miniature chip type designed for surface mounting
|
IDEA.lnc.
|
JGC0195 |
miniature chip type designed for two-way surface mounting
|
IDEA.lnc.
|
IVYC0128 |
miniature chip type designed for surface mounting
|
IDEA.lnc.
|
JYOC0198 |
miniature chip type designed for surface mounting
|
IDEA.lnc.
|
IVGC0128 |
miniature chip type designed for surface mounting
|
IDEA.lnc.
|
JYBC0118 |
miniature chip type designed for surface mounting and measure approximately 2.5 x 3 mm
|
IDEA.lnc.
|
JDVGC0118 |
miniature chip type designed for surface mounting and measure approximately 2.5 x 3 mm
|
IDEA.lnc.
|
IVGC0178 |
miniature lens type designed for surface mounting
|
IDEA.lnc.
|
M50752-PGYS M50752-XXXSP M50757-XXXSP |
The M50752-PGYS is an EPROM mounted-type microcomputer employing a silicon gate CMOS process and was designed for developing programs for single-chip Piggyback The M50752-PGYS is an EPROM mounted-type microcomputer employing a silicon gate CMOS process and was designed for developing programs for single-chip 在M50752 - PGYS是存储器安装型微机采用硅栅CMOS工艺,并负责制定项目设计的单芯片
|
Mitsubishi Electric Semiconductor Mitsubishi Electric Corporation Mitsubishi Electric, Corp.
|
SSGM640200 SSGM120100 SSGM720101 SSGM740101 SSGM76 |
2 to 10 Circuits-designed Type
|
ALPS ELECTRIC CO.,LTD.
|
S3P7048 S3C7044 S3C7048 |
The S3C7044/C7048 single-chip CMOS microcontroller has been designed for very high-performance using Samsungs newest 4-bit CPU core, SAM47 (Samsung Ar The S3C7044/C7048 single-chip CMOS microcontroller has been designed for very high-performance using Samsungs newest 4-bit CPU core, SAM47 (Samsung Ar 在S3C7044/C7048单芯片CMOS微控制器设计了非常高的性能三星则采用最新的4位CPU核心,SAM47(三星氩 The S3C7044/C7048 single-chip CMOS microcontroller has been designed for very high-performance using Samsungs newest 4-bit CPU core/ SAM47 (Samsung Ar
|
Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD.
|
AM29824DM AM29826DM AM29822DM AM29822LMB AM29822DM |
9-Bit D-Type Flip-Flop Reference Design kit for the iP1206 a 300kHz, 30A Synchronous Buck Converter; A IRDCIP1206-B with Standard Packaging Intelligent Power Module. Gate Driver IC integrated with a half bridge FredFET Designed for sub 250W Motor Drive applications in a 9-Lead SIP. RDSon of 1.0 Ohm; A IR3101 with Standard Packaging 10位D型触发器 IR1150 Demo Board designed for use in continuous conduction mode boost converter applications for power factor correction and harmonic current reduction.; A IRAC1150-300W with Standard Packaging 10位D型触发器 Octal D-Type Flip-Flop 八路D类触发器
|
Toshiba, Corp. Electronic Theatre Controls, Inc. ITT, Corp. ATM Electronic, Corp.
|