PART |
Description |
Maker |
081029133013 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
SOT-89-3L |
PACKAGE OUTLINE DIMENSIONS
|
ETC
|
X2-DFN0806-3 X3-DFN0603-2 X1-DFN1212-3 X1-DFN1006- |
PACKAGE OUTLINE DIMENSIONS
|
Diodes Incorporated
|
R-8 |
8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions
|
Analog Devices
|
8SOIC |
8 PIN SOIC PACKAGE OUTLINE 8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|