| PART |
Description |
Maker |
| K9KAG08U0MPIB00 K9KAG08U0M-PCB0000 K9KAG08U0MPCK00 |
sheet of this product is either in preparation or is not effective yet. For more details about product specifications or technical files, please inquire through Contact us
|
Samsung semiconductor
|
| D88104-001US DG33BU |
Technical Product Specification
|
Intel Corporation
|
| DQ965CO D56019-001US |
Technical Product Specification
|
Intel Corporation
|
| D96939-001US DQ35JO |
Technical Product Specification
|
Intel Corporation
|
| D865GSA D56006-001US |
Technical Product Specification
|
Intel Corporation
|
| D96938-001US |
Technical Product Specification
|
Intel Corporation
|
| DQ965GF D56021-001US |
Technical Product Specification
|
Intel Corporation
|
| TMP86C847 TMP86C846 TMP86CH46 TMP86CH47 TMP86CK74 |
The product information available by this search method contains an overview of each product only.
|
TOSHIBA
|
| V850E1 V850E_SV2 V850E_IA1 V850E_IA2 V850E_IA3 V85 |
V850E/IA2 Flash product ROM: 128 KB, RAM: 6 KB
V850E/IA2 Mask product ROM: 128 KB, RAM: 6 KB
V850E/IA3 Flash product ROM: 256 KB, RAM: 12 KB
ROM-less version; Internal RAM: 4K bytes
32-bit RISC single-chip microcontroller V850E/SV2
V850E/IA4 Flash memory product ROM: 256 KB, RAM: 12 KB
32-Bit Microprocessor Core
|
NEC[NEC]
|
| S2325USOWA-S530-A3 ELS-2325USOWA_S530-A3 ELS-2325U |
7 SEG NUMERIC DISPLAY, REDDISH ORANGE, 57 mm ROHS COMPLIANT PACKAGE-10
Technical Data Sheet 2.24 Single Digit Displays
Technical Data Sheet 2.24" Single Digit Displays
|
Everlight Electronics Co., Ltd.
|
| S75WS256NDFBFWLJ3 S75WS256NDFBAWLK2 S75WS256NDFBFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
Spansion, Inc.
SPANSION LLC
|
