PART |
Description |
Maker |
NP276-16951 NP276-25626 NP276-11904-3 NP276-59608 |
Ball Grid Array (BGA, 1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
1FGSXXXX |
Ball Grid Array Socketing System
|
Advanced Interconnections
|
NP352-04808 NP352-04811 NP352-04813 NP352-1849-35 |
Fine Ball Grid Array (FBGA, 1.00mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Component Limited. FUJITSU[Fujitsu Media Devices Limited]
|
3-1640240-4 |
Matrix Series Ball Grid Array ( BGA ) Sockets; 2401 POSITION BGA SOCKET ASSEM ( Tyco Electronics )
|
Tyco Electronics
|
1-54-712 1-54-724 1-54-716 1-54-732 1-54-708 |
HAMMER BALL PEIN 12OZ HAMMER BALL PEIN 24OZ HAMMER BALL PEIN 32OZ HAMMER BALL PEIN 8OZ HAMMER BALL PEIN 16OZ 锤球石工16安士
|
ITT, Corp.
|
CHC-CD0865A-01-10R0F CHC-CD0865A-01-10R0G CHC-CD08 |
Ceramic Ball Grid Termination Arrays
|
IRC - a TT electronics Company.
|
AMG8852 AMG8851 AMG8831 AMG8832 |
Infrared Array Sensor Grid-EYE
|
Panasonic Semiconductor
|
YPKG-C7CG-A7A2DC |
CCGA1272, 37.5 MM X 37.5 MM, 1.0 MM PITCH, 1272 SOLDER COLUMNS, CERAMIC COLUMN GRID ARRAY, DAISY CHAIN PACKAGE
|
Actel Corporation
|
CA-PLCC20-Z-M-T-01 |
Carrier Adapter 20 Position PLCC ZIF Socket with test points to mini-grid array interface. Pin mapping is 1:1.
|
Ironwood Electronics.
|
KEST-471BT KEST-471BW KEST-471SW KEST-472BT KEST-4 |
Sleeve or Ball Bearing
|
Kepont Electronics, Inc. Kepont Electronics, Inc...
|