| PART |
Description |
Maker |
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| LTV-849 LTV-849M LTV-849S LTV-829 LTV-829S-TA LTV8 |
HIGH DENSITY MOUNTING TYPE PHOTOCOUPLER
|
LITEON[Lite-On Technology Corporation]
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS
|
| HPCL-817 HPCL817 |
Phototransistor Optocoupler High Density Mounting Type
|
Agilent Technologies
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| PC861 |
High Collector-emitter Voltage/ High Density Mounting Type Photocoupler
High Collector-emitter Voltage High Density Mounting Type Photocoupler
High Collector-emitter Voltage, High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| HCPL-817 HCPL-817-0 HCPL-817-3 HCPL-817-5 HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type 光电晶体管光电耦合器高密度安装类型
|
TE Connectivity, Ltd.
Avago Technologies, Ltd.
Diodes, Inc.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
|
| ISP817X |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| IS2701-1 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
List of Unclassifed Manufacturers
ISOCOM
|
| TLP621-2 TLP621-4 TLP621 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| ISP521-1 ISP521-1X ISP521-2 ISP521-2X ISP521-4 ISP |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
List of Unclassifed Manufacturers
ISOCOM
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| LTV-358T |
Hybrid substrates that require high density mounting, Programmable controllers
|
Lite-On Technology Corporation
|
