PART |
Description |
Maker |
8P008SRV1303I15 8P001SRV1303C15 8P008SRV1303C25 8P |
4M X 16 MULTI DEVICE SRAM CARD, 150 ns, XMA68 CARD-68 64K X 16 MULTI DEVICE SRAM CARD, 150 ns, XMA68 CARD-68 4M X 16 MULTI DEVICE SRAM CARD, 250 ns, XMA68 CARD-68 64K X 16 MULTI DEVICE SRAM CARD, 250 ns, XMA68 CARD-68 128K X 16 MULTI DEVICE SRAM CARD, 250 ns, XMA68 CARD-68 256K X 16 MULTI DEVICE SRAM CARD, 250 ns, XMA68 CARD-68 384K X 16 MULTI DEVICE SRAM CARD, 250 ns, XMA68 CARD-68 128K X 16 MULTI DEVICE SRAM CARD, 150 ns, XMA68 CARD-68 256K X 16 MULTI DEVICE SRAM CARD, 150 ns, XMA68 CARD-68 384K X 16 MULTI DEVICE SRAM CARD, 150 ns, XMA68 CARD-68
|
White Electronic Designs, Corp.
|
CYM1420HD-55MB |
128K X 8 MULTI DEVICE SRAM MODULE, 55 ns, DMA32
|
Cypress Semiconductor, Corp.
|
CYM1422PS-55C |
128K X 8 MULTI DEVICE SRAM MODULE, 55 ns, SMA30
|
Cypress Semiconductor, Corp.
|
WS128K32NV-17H1MA WS128K32NV-17H1C WS128K32NV-17H1 |
128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
Microsemi, Corp. White Electronic Designs, Corp.
|
DPS128X16A3-85M DPS128X16H3-85M DPS128X16H3-85B DP |
256K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CPGA50 CERAMIC, MODULE, SLCC, PGA-50 256K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CQFP48 GULLWING, SLCC-48 256K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CQIP48 SLCC-48
|
Twilight Technology, Inc.
|
EDI8C32128C WS128K32-XXX EDI8C32128LP17EI |
128Kx32 SRAM Module(低功耗CMOS12Kx32静态RAM模块(存取时5705555ns 128Kx32 SRAM Module(低功耗CMOS28Kx32静态RAM模块(存取时5705555ns 128Kx32 SRAM Module(低功耗CMOS12Kx32静态RAM模块(存取时57055555ns 128Kx32 SRAM Module(低功耗CMOS28Kx32静态RAM模块(存取时57205555ns 128Kx32 SRAM的模块(低功耗的CMOS28Kx32静态内存模块(存取时间15,17,20,25,35,45,55纳秒)) 128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68
|
White Electronic Designs Corporation TE Connectivity, Ltd.
|
SYS32256LK-30 SYS32256ZK-30 SYS32256LKLI-30 SYS322 |
256K X 32 MULTI DEVICE SRAM MODULE, 30 ns, SMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 30 ns, ZMA64 PLASTIC, ZIP-64
|
TE Connectivity, Ltd.
|
CY7C1019CV33 CY7C1019CV33-12VI CY7C1019CV33-15VC C |
128K x 8 Static RAM 128K的8静态RAM JT 26C 26#20 SKT RECP 128K X 8 STANDARD SRAM, 8 ns, PDSO32 128K x 8 Static RAM 128K X 8 STANDARD SRAM, 12 ns, PDSO32 128K x 8 Static RAM 128K X 8 STANDARD SRAM, 15 ns, PDSO32 128K x 8 Static RAM 128K X 8 STANDARD SRAM, 10 ns, PDSO32 128K x 8 Static RAM 128K X 8 STANDARD SRAM, 8 ns, PDSO32 Memory : Async SRAMs
|
Cypress Semiconductor, Corp. Cypress Semiconductor Corp. CYPRESS[Cypress Semiconductor]
|
MT2LSYT3272B2G-12L MT4LSYT6472B2G-12L |
32K X 72 MULTI DEVICE SRAM MODULE, 12 ns, DMA160 64K X 72 MULTI DEVICE SRAM MODULE, 12 ns, DMA160
|
RECOM Electronic GmbH
|
CYM1821PZ-12C CYM1821PM-12C |
16K X 32 MULTI DEVICE SRAM MODULE, 12 ns, ZMA64 16K X 32 MULTI DEVICE SRAM MODULE, 12 ns, SMA64
|
Cypress Semiconductor, Corp.
|
EMS256K8BMO2-55M EMS256K8BMO2-55D EMS256K8BMO6-55I |
256K X 8 MULTI DEVICE SRAM MODULE, 55 ns, CDMA32 256K X 8 MULTI DEVICE SRAM MODULE, 55 ns, PDMA32
|
OKI SEMICONDUCTOR CO., LTD.
|
MSM8256V-55/X0252 MSM8256V-025/X0252 MSM8256VM-025 |
256K X 8 MULTI DEVICE SRAM MODULE, 55 ns, CDIP32 256K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDIP32 256K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CDXA32
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