PART |
Description |
Maker |
MWDM1L-GP-0E MWDM2L-GP-0E MWDM4L-GP-0E MWDM5L-GP-0 |
Micro-D Metal Shell MWDM Back-To-Back Unshielded Cable Assemblies
|
Glenair, Inc.
|
MSU3142 |
LCD-less 120 Voice Smart LCD-less 120Voice Smart Monolithic Talking Microcomputer(语音存储时间20秒,单片语音智能微型电子计算
|
Mosel Vitelic Corp MOSEL[Mosel Vitelic, Corp] Mosel Vitelic, Corp.
|
MSU3122 |
LCD-less 60 Voice smart LCD-less 60voice smart monolithic talking microcomputer(语音存储时间0秒,单片语音智能微型电子计算
|
Mosel Vitelic Corp Mosel Vitelic, Corp.
|
ADN2526 ADN2526ACPZ ADN2526ACPZ-R2 ADN2526ACPZ-R7 |
11.3 Gbps Active Back-Termination, Differential Laser Diode Driver 11.3 Gbps Active Back-Termination Differential Laser Diode Driver; Package: 16-LFCSP (3x3mm, 1.50mm exposed pad); Temperature Range: -40°C to 125°C SPECIALTY INTERFACE CIRCUIT, QCC16
|
Analog Devices, Inc.
|
K-04204GX K-03203GX |
LCD BACK LIGHT, COB TYPE, LCD CHARACTER 16X1(L) LCD BACK LIGHT, COB TYPE, LCD CHARACTER 161(L)
|
List of Unclassifed Manufacturers ETC[ETC]
|
L-02401G-B5 |
BACK LIGHT
|
LIGITEK electronics co....
|
6411 |
Back Probe Pin
|
Pomona Electronics
|
PCP1208 |
LED Back Light
|
Sanyo Semicon Device
|
C317 C412 C315 C410 C340320C102D2U5CA C340320C102D |
MILITARY SPECIFCATIONS ON BACK
|
KEMET[Kemet Corporation]
|
NEXC224Z55V105X85TRF NEXC224Z35V105X55TRF NEXC104Z |
V-Chip Memory Back-Up Capacitors
|
NIC-Components Corp.
|
HBU0602E-67 |
Back Electret Condenser Microphone
|
JL World Company Limited.
|