PART |
Description |
Maker |
M6MGT331S8BKT M6MGB331S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
M6MGT641S8BKT M6MGB641S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
M6MGT331S4BKT M6MGB331S4BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
K5D5657DCM-F015 K5D5657DCM-F0CL |
MCP Specification of 256Mb NAND and 256Mb Mobile SDRAM MCP / 256Mb NAND and 256Mb Mobile SDRAM
|
SAMSUNG[Samsung semiconductor] Samsung Electronics
|
WED2ZLRSP01S-BC |
NBL SSRAM MCP NBL的的SSRAM MCP
|
Electronic Theatre Controls, Inc.
|
S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84 Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
|
Spansion Inc. Spansion, Inc.
|
S70WS512N00BFWA23 S70WS512N00BAWAB3 S70WS512N00BAW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory 同硅晶片堆叠多芯片产品(MCP)的512兆位2兆16位)的CMOS 1.8伏,只有同时写,突发模式闪存
|
Spansion Inc. Spansion, Inc.
|
DS42585 AM29DL324D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
HB52F328DC-75BL |
256 MB Unbuffered SDRAM S.O.DIMM 32-Mword × 64-bit, 133 MHz Memory Bus, 2-Bank Module (8 pcs of 16 M × 16 components) PC133 SDRAM x64 SDRAM Module X64的内存模
|
Elpida Memory Vishay Intertechnology, Inc.
|
AM41DL32X4GT85IS AM41DL32X4GT85IT AM41DL32X4GB85IT |
SPECIALTY MEMORY CIRCUIT, PBGA73 Circular Connector; No. of Contacts:41; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:21; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No 堆叠式多芯片封装(MCP)闪存和SRAM Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Spansion, Inc. Advanced Micro Devices
|
S71WS512ND0BAWAN3 S71WS512ND0BAWAP0 S71WS256ND0BAW |
Stacked Multi-Chip Product (MCP) Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
http:// SPANSION[SPANSION] Spansion, Inc.
|