| PART |
Description |
Maker |
| 79C0408 79C0408RT2FH-15 79C0408RT2FK-15 79C0408RT2 |
4 Megabit (512k x 8-bit) EEPROM MCM 512K X 8 EEPROM 5V MODULE, 200 ns, DFP40
4 Megabit (512k x 8-bit) EEPROM MCM 512K X 8 EEPROM 5V MODULE, 120 ns, DFP40
4 Megabit EEPROM MCM
512K X 8 EEPROM 5V MODULE, 150 ns, DFP40
4 Megabit EEPROM MCM
|
Maxwell Technologies, Inc
|
| WE512K16-XG4X WE512K16-140G4C WE512K16-140G4CA WE5 |
Access time:200 ns; 5V power supply; 512K x 16 CMOS EEPROM module
Access time:20150 ns; 5V power supply; 512K x 16 CMOS EEPROM module
Access time:150 ns; 5V power supply; 512K x 16 CMOS EEPROM module
Access time:140 ns; 5V power supply; 512K x 16 CMOS EEPROM module
EEPROM MCP
|
White Electronic Designs
|
| PUMA2F16006M-90 PUMA2F16006-90 PUMA2F16006M-120E P |
32-Tap, Volatile DPP with I2C/DEC, Up/Down Interface, TSSOP
BGA, ROHS-A, IND TEMP, T&R(ARM)
BGA,GREEN,IND TEMP,T&R(ARM)
x32 Flash EEPROM Module X32号，闪存EEPROM模块
EEPROM EEPROM
|
Infineon Technologies AG
Amphenol Tuchel
|
| WE128K32-XH1X WE128K32-XG2TX WE128K32NP-200H1Q WE1 |
EEPROM MCP
128K X 32 EEPROM 5V MODULE, 200 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 120 ns, CPGA66 1.075 x 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 150 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 140 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 250 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
Microsemi, Corp.
White Electronic Designs, Corp.
|
| AS8E512K8CW-150_HQ AS8E512K8CW-150_IT AS8E512K8CW- |
512K x 8 EEPROM EEPROM Module
|
Austin Semiconductor
|
| PUMA67E4007AM-25 PUMA67E4007AM-25E PUMA67E4007-20 |
x32 EEPROM Module
150NS, TSOP, IND TEMP(EEPROM)
150NS, PDIP, IND TEMP(EEPROM)
150NS, FLATPACK, 883C; LEV B CMPLNT(EEPROM)
150NS, PLCC, COM TEMP(EEPROM)
200NS, FLATPACK, 883C; LEV B COMPLIANT(EEPROM)
150NS, 44LCC, 883C; LEV B COMPLIANT(EEPROM)
350NS,PGA,883C; LEVEL B FULLY COMPLIANT(EEPROM)
150NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM)
250NS, 32LCC, 883C; LEV B COMPLIANT(EEPROM)
250NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM)
150NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM)
250NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM)
120NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM)
150NS, PLCC, AUTO TEMP(EEPROM) X32号的EEPROM模块
150NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM) X32号的EEPROM模块
200NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM) X32号的EEPROM模块
DIE(EEPROM) X32号的EEPROM模块
200NS, PDIP, IND TEMP(EEPROM)
|
Microtips Technology, Inc.
Amphenol, Corp.
TE Connectivity, Ltd.
|
| 80-0274-E |
VR Stamp With Serial EEPROM Speech Recognition Module
VR Stamp⑩ With Serial EEPROM Speech Recognition Module
|
List of Unclassifed Manufacturers
ETC[ETC]
|
| SST29LE010-150-4C-NHE CAT25C33Y20 GLS29EE512-70-4I |
EEPROM 128K X 8 150ns
EEPROM (4kx8) 32K 2.5-6.0
EEPROM 64K X 8 70ns
EEPROM 128K X 8 70ns
16Kb Add-Only Memory 16K X 1 OTPROM, PDSO6
|
Silicon Storage Technology, Inc.
Advanced Semiconductor, Inc.
Maxim Integrated Products
|
| BR25H020F-2LB |
Serial EEPROM Series Industrial EEPROM 125?Operation SPI BUS EEPROM
|
Rohm
|
|
