| PART |
Description |
Maker |
| 85513-5015 |
SMT Jack for Mating with F.C.C 68 Plugs, 6/4 Circuits
|
Molex Electronics Ltd.
|
| 85513-5002 |
SMT Jack for Mating with F.C.C 68 Plugs, 6 Circuits
|
Molex Electronics Ltd.
|
| 85513-5012 |
SMT Jack for Mating with F.C.C 68 Plugs, 4 Circuits
|
Molex Electronics Ltd.
|
| 67492-1631 0674921631 |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height 4.45mm (.175"), 0.76渭m (30渭") Gold (Au) Plating, with Cap,Embossed Tape on Reel
1.27mm (.050) Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height 4.45mm (.175), 0.76μm (30μ) Gold (Au) Plating, with Cap,Embossed Tape on ReelPackaging,22 Circuits, Lead Free
|
Molex Electronics Ltd.
|
| DBCPJ0217T-1.0 DBCPJ0217T-1.3 |
AUDIO SMT DC JACK SOCKET
|
Dubilier
|
| UE75-A20-6000T P-UX75-A20-X00XX |
SFP 20 POSITION HIGH SPEED CONNECTOR RECEPTACLE FIXED BOARD, RIGHT ANGLE SMT OPTIONAL PLATING AND LUBRICANT ON MATING
d-sub technical data
|
Amphenol Corporation
|
| E5288-300BB1-L E5288-3007B5-L E5288-300BB3-L E5288 |
TOP ENTRY PCB JACK 8P SMT
|
Pulse A Technitrol Comp...
|
| 67492-1630 0674921630 |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height4.45mm (.175"), Gold (Au) Flash, with Cap, Embossed Tape on Reel Packaging, 22Ci
1.27mm (.050) Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height4.45mm (.175), Gold (Au) Flash, with Cap, Embossed Tape on Reel Packaging, 22Circuits, Lead Free
|
Molex Electronics Ltd.
|
| 0879331007 87933-1007 |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05μm (2μ) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05渭m (2渭) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
|
http://
Molex Electronics Ltd.
|
| 0855105026 |
Modular Jack, Vertical, SMT, 6/4, Solder Tabs
|
Molex Electronics Ltd.
|
| 0441440002 44144-0002 |
Modular Jack, Right Angle, Low Profile, SMT, 8/6
|
Molex Electronics Ltd.
|
|
