| PART |
Description |
Maker |
| R1LP0408C R1LP0408CSB-5SI R1LP0408CSB-7LI R1LP0408 |
Wide Temperature Range Version 4 M SRAM (512-kword ??8-bit)
R1LP0408C-I Series Datasheet 78K/AUG.01.03
Standard Thick Film Chip Resistor: 10 ohms through 10 megohms, 5 %, 200 ppm, .100 W
Wide Temperature Range Version 4 M SRAM (512-kword 8-bit)
Wide Temperature Range Version 4 M SRAM (512-kword × 8-bit)
Wide Temperature Range Version 4 M SRAM (512-kword 8-bit)
Wide Temperature Range Version 4 M SRAM (512-kword 】 8-bit)
Memory>Low Power SRAM
|
Hitachi,Ltd.
HITACHI[Hitachi Semiconductor]
Renesas
|
| M37735EHBXXXFP M37735EHBFS |
PROM VERSION OF M37735MHBXXXFP
PROM VERSION OF M37735EHBXXXFP
|
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| 0740592514 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 150 Circuits, Pin
|
http://
|
| UPD703100AGJ-33-UEN UPD703100GJ-33-UEN UPD703101AG |
ROM-less version; Internal RAM: 4K bytes
Mask ROM version; Mask ROM: 96K bytes; Internal RAM: 4K bytes
Mask ROM version; Mask ROM: 128K bytes; Internal RAM: 4K bytes
Flash version; Internal flash: 128K bytes; Internal RAM: 4K bytes
32-bit RISC microcontroller (V850E/MS2:ROMless,Internal RAM: 4 KB)
|
NEC
|
| 74059-1014 0740591014 |
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 6-Row, Guide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Leng
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row, Guide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Length 5.15mm (.203)
|
Molex Electronics Ltd.
|
| 74059-2503 0740592503 |
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 150 Circuits, Pin
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 150 Circuits, Pin
|
Molex Electronics Ltd.
http://
|
| EETHC2A222CA EETHC2A222DA EETHC2A272CA EETHC2A332C |
Highly miniaturized version (30% smaller than HB series) Can vent construction
Aluminum Electrolytic Capacitors
Highly miniaturized version (30% smaller than HB series)
|
Panasonic Battery Group
Panasonic Semiconductor
|
| BUK473-100A BUK473-100B |
PowerMOS transistor Isolated version of BUK453-100A/B
PowerMOS transistor Isolated version of BUK453-100A/B 9 A, 100 V, 0.16 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220
|
Philips Semiconductors
NXP Semiconductors N.V.
|
| W83877ATF W83877ATD |
enhanced version from Winbonds most popular I/O chip W83877F
enhanced version from Winbonds most popular I/O chip W83877F
|
Winbond Electronics Corp
|
| HM62A16100I HM62A16100LBPI-7 HM62A16100LBPI-7SL |
Wide Temperature Range Version 16 M SRAM (1-Mword × 16-bit)
Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit)
Memory>Low Power SRAM
|
Renesas Electronics Corporation
|
| AT71200M AT71200MCRER AT71200MCRERB AT71200MCRHR |
AT71200M Monochrome [Updated 2/03. 23 Pages] Full field CCD. 3500 x 2300 pixels. 4 x 25 MHz
Full field image sensor 3500 x 2300 pixels, 4 x 25 MHz
8M-pixel color image sensor. Full frame version standard image grade. Anti-reflective window.
8M-pixel color image sensor. Frame transfer version with two memories zones. Anti-reflective window.
8M-pixel color image sensor. Full frame version high image grade. Anti-reflective window.
|
Atmel
|
