PART |
Description |
Maker |
LVDS |
LVDS Description and Family Characteristics LVDS Description and Family Characteristics
|
Fairchild Semiconductor Corporation
|
HT3401 |
General Description
|
TY Semiconductor Co., Ltd TY Semiconductor Co., L...
|
8XC251TP 8XC251SP 8XC251TA 8XC251SB 8XC251SQ 8XC25 |
Hardware Description
|
Intel Corporation
|
SGF5N150UF |
GENERAL DESCRIPTION
|
Fairchild Semiconductor
|
W77E058A40DL |
GENERAL DESCRIPTION
|
Nuvotem Talema
|
STA-6033 |
Product Description
|
List of Unclassifed Manufacturers Sirenza Microdevices ETC[ETC] Electronic Theatre Controls, Inc.
|
AN2725 |
a brief description of the TS2012 device
|
STMicroelectronics
|
TMS27PC512-12DDE TMS27PC512-12DDE4 TMS27PC512-10DU |
PLCC Clip-on Adapters; Top Pin Count: 32; Bottom Pin Count: 32; Part Description: PLCC IC Clip; Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.5; IC Size X (mm): 4; IC Size Y (mm): 4; Socket Lid: Swivel; Max Pincount: 20; Part Description: Diamond GHz QFN/MLF Socket (ZIF); Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.65; IC Size X (mm): 6; IC Size Y (mm): 6; Socket Lid: Swivel; Max Pincount: 28; Part Description: Diamond GHz QFN/MLF Socket (ZIF); x8 EPROM x8存储 FPGA Development: XILINX; Top Pin Count: 84; Bottom Pin Count: 84; Top Interface: PLCC SOCKET; Bottom Interface: PLCC PLUG; Device Specific: yes; Devices Supported: XC3020, 3030, 3042; Part Description: Xilinx FPGA adapter; x8存储
|
Maxim Integrated Products, Inc. Clare, Inc. TE Connectivity, Ltd.
|
MMC351 |
Auto clock general description
|
Micro Electronics
|
AOV15S60 |
DFN8X8 PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
SGL40N150 SGL40N150TU |
Discrete, IGBT General Description
|
FAIRCHILD[Fairchild Semiconductor]
|
AOTF3N80L |
TO220F PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|