| PART |
Description |
Maker |
| RSM2-XX-SG-SMT-10-P-PP-TR |
DUAL ROW FEMALE HEADER
|
Adam Technologies, Inc.
|
| 829-22-012-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-014-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-008-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-020-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 350-10-101-00-001000 350-10-164-00-001000 350-90-1 |
HEADER STRIPS .100隆卤 Grid Solder Tail Single Row
HEADER STRIPS .100 Grid Solder Tail Single Row
|
Mill-Max Mfg. Corp.
|
| 810-22-003-40-001101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Surface Mount
|
Mill-Max Mfg. Corp.
|
| 0901200960 90120-0960 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 40 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0901210765 90121-0765 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, 5 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| SDA-44472-0311 44472-0311 0444720311 |
4.20mm (.165) Pitch Mini-Fit HCS Header, Single Row, Vertical
4.20mm (.165") Pitch Mini-Fit HCS垄芒 Header, Single Row, Vertical
|
Molex Electronics Ltd.
|
| D2PH-1-XX-U-CDE |
SINGLE ROW PIN HEADER
|
Adam Technologies, Inc.
|
