| PART |
Description |
Maker |
| AN1235 |
package description and recommendations for use
|
STMicroelectronics
|
| AN11689 |
Recommendations for PCB assembly of DSN1006
|
NXP Semiconductors
|
| AN3150 |
Soldering Recommendations for Pressure Sensor Devices
|
Freescale Semiconductor, Inc
|
| TN1171 |
Description of UFDFPN5, UFDFPN8 and WFDFPN8 for STMicroelectronics EEPROMs and recommendations for use
|
STMicroelectronics
|
| AN1553 |
FLIP CHIP 300MICRONSM RECOMMENDATIONS FOR AUDIO POWER AMPLIFIER
|
SGS Thomson Microelectronics
|
| AN-1109 502R29W151KV3E-SC DE2B3KY151KA2BM01 |
Recommendations for Control of Radiated Emissions with iCoupler Devices
Recommendations for Control of Radiated Emissions with iCoupler Devices
|
Analog Devices
|
| TB520-XX TB502 TB502-3X |
Test Board for chip evaluation and Layout recommendations
|
PLL[PhaseLink Corporation]
|
| AN2027 |
Mounting recommendations for ceramic DMOS packages
|
STMicroelectronics
|
