| PART |
Description |
Maker |
| MSAFA1N100D |
Fast MOSFET Die for Implantable Cardio Defibrillator Applications
|
Microsemi Corporation
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| 907-0010 912-0120 914-0040 914-0070 914-0140 912-0 |
PUNCH&DIE SET 3-12MM
PUNCH&DIE 10.0MM CIRCULAR
PUNCH&DIE 16.5MM CIRCULAR
PUNCH&DIE 25.0MM CIRCULAR
PUNCH&DIE 12.0MM CIRCULAR
PUNCH&DIE 9.0MM CIRCULAR
PUNCH&DIE 20.0MM CIRCULAR
PUNCH&DIE 12.5MM CIRCULAR
STRIPPER 37.0 X 13.7 D CON
STRIPPER 31.75MM DIAMETER 低产31.75MM直径
LOUVRE TOOL 卢浮宫工
PUNCH&DIE 10.0MM CIRCULAR
STRIPPER 67.2 X 16.5 D CON
|
Peregrine Semiconductor, Corp.
Molex, Inc.
|
| IRLC1304 2299 |
HEXFET Power MOSFET Die in Wafer Form(晶圆形式的HEXFET 功率MOS场效应管)
From old datasheet system
HEXFET? Power MOSFET Die in Wafer Form
|
International Rectifier
|
| 5SLX12K1711 |
Fast-Diode Die
|
The ABB Group
|
| 5SLX12M3301 |
Fast-Diode Die
|
The ABB Group
|
| NGTD8R65F2 NGTD8R65F2SWK NGTD8R65F2WP |
Fast Switching Rectifier Die
|
ON Semiconductor
|
| IRFC460AB |
TRANSISTOR | MOSFET | N-CHANNEL | 515V V(BR)DSS | CHIP 晶体管| MOSFET的| N沟道| 515V五（巴西）决策支持系统|芯片
HEXFET? Power MOSFET Die in Wafer Form
|
International Rectifier, Corp.
|
| IXFE23N100 |
(IXFE23N100 / IXFE24N100) Single MOSFET Die
|
IXYS Corporation
|
| IXFN39N90NBSP IXFN39N90 |
HiPerFET Power MOSFETs Single MOSFET Die
|
IXYS[IXYS Corporation]
|
| S2305 |
N-channel SiC power MOSFET bare die
|
Rohm
|
