| PART |
Description |
Maker |
| AN576 |
PCB LAYOUT OPTIMISATION
|
SGS Thomson Microelectronics
|
| ZX360D-B-10P |
RECOMMENDED PANEL CUTOUT PCB LAYOUT FOR REFERENCE
|
Hirose Electric
|
| AN10778 |
PCB layout guidelines for NXP MCUs in BGA packages
|
NXP Semiconductors
|
| AN56 |
NOVRAM AUTOSTORE Considerations
|
Xicor
|
| AN-0003 |
Thermal Considerations for Power Amplifiers
|
ANADIGICS, Inc
|
| HA3-2546-5 |
Circuit Considerations In Imaging Applications
|
Intersil Corporation
|
| AN-CC1002 |
Design Considerations for ISD1700 Family
|
http://
Winbond
|
| AN1149-3 |
Electrical Design Considerations for SuperFlux LEDs
|
Lumileds Lighting Company
|
| AB20-5 |
Secondary Optics Design Considerations for SuperFlux LEDs
|
Lumileds Lighting Company
|
| MPC823 |
This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC823.
|
Freescale Semiconductor...
|
| RM36W4P-50-ZB |
D-SUB HOUSING LAYOUT
|
Winchester Electronics ...
|
