PART |
Description |
Maker |
MC-5951 |
GaAs Multi-Chip Integrated Circuit
|
NEC Electronics
|
STA8058 |
GPS multi-chip module
|
ST Microelectronics
|
ROK104022 ROK104001 ROK104021 |
Bluetooth MULTI CHIP MODULE
|
Infineon Technologies A... Infineon Technologies AG
|
FDMF8705 |
Driver plus FET Multi-chip Module
|
Fairchild Semiconductor
|
TH50VPN564 TH50VPN5640EBSB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS PSEUDO SRAM AND NAND E2PROM MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
AK49064SP-10 AK44064SP-10 AK44256SN-12 AK411024SRM |
64K X 9 MULTI DEVICE DRAM MODULE, 100 ns, SMA30 64K X 4 MULTI DEVICE DRAM MODULE, 100 ns, SMA22 256K X 4 MULTI DEVICE DRAM MODULE, 120 ns, SMA22 1M X 1 MULTI DEVICE DRAM MODULE, 150 ns, SMA22 128K X 1 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18 64K X 2 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
|
|
WEDPNF8M721V-XBX WEDPNF8M721V-1010BC WEDPNF8M721V- |
8Mx72 Synchronous DRAM 8Mb Flash Mixed Module Multi-Chip Package 8Mx72同步DRAM 8MB闪存的混合模块多芯片封装
|
Electronic Theatre Controls, Inc. List of Unclassifed Manufacturers
|
CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52 8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20 IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感 Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc. Bourns, Inc.
|
FDMF8704 |
High Efficiency / High Frequency FET plus Driver Multi-chip Module
|
Fairchild Semiconductor
|
SKY77602 |
Multi-Band, Multi-Mode (3G) Power Amplifier Module w/ PA Distribution Switch
|
Skyworks Solutions Inc.
|
PQ05R01 PQ05R02 PQ05R03 PQ05R04 PQ09R04 PQ12R02 PQ |
Multi Functional Regulator Module MULTI-FUNCTIONAL REGULATOR MODULE RF/Coaxial Connector; RF Coax Type:BNC; Contact Termination:Crimp; Body Style:Right Angle Plug; RG Cable Type:59, 62, 140, 210, Belden 8241, 8263, 8279, 9209 RoHS Compliant: Yes 多功能稳压模
|
Sharp List of Unclassifed Manufacturers ETC[ETC] Electronic Theatre Controls, Inc.
|
SYS321000LK-012 SYS321000LK-015 SYS321000ZK-015 SY |
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72 1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZIP72 PLASTIC, ZIP-72 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72 1M X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZIP72 PLASTIC, ZIP-72 x32 SRAM Module X32号的SRAM模块 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PZIP72 PLASTIC, ZIP-72
|
Sumida, Corp. TE Connectivity, Ltd.
|
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