| PART |
Description |
Maker |
| APF30-30-06CB APF30-30-10CB APF30-30-13CB APF40-40 |
Series APF Low Height Thin-Fin Forged Heat Sinks
|
CTS Corporation
|
| AER19-19-21CB AER19-19-21CB_S AER19-19-18CB AER19- |
AER Forged Heat Sinks
TMS570 Microcontroller Development Kit
High Performance Synchronous Buck Evaluation Module Using TPS51125A
CC1190EM 868MHz Reference Design
BQ20Z60 SBS 1.1 Impedance Track Technology Enabled Battery Management Solution Evaluation Module
OMAP-L137/TMS320C6747 Floating Point Starter Kit
TMS570 Microcontroller USB Kit
BQ20Z65 SBS 1.1 Impedance Track Technology Enabled Battery Management Solution Evaluation Module
Evaluation Module for TPS65072 Single Chip Power Solution for Navigation Systems
|
CTS[CTS Corporation]
|
| S30AG250KY1234 |
HEAT SINKS AND STANDOFFS
|
Dielectric Laboratories, Inc.
|
| ATS-1043-C3-R0 |
Cross Cut High Performance Heat Sinks with Hardware Attachment
|
Advanced Thermal Soluti...
|
| ATS-1042-C3-R0DS |
maxiFLOW Cross Cut High Performance Heat Sinks with Hardware Attachment
|
Advanced Thermal Solutions, Inc.
|
| ATS-1038-C1-R0DS |
maxiFLOW Cross Cut High Performance Heat Sinks with Plastic Push Pin
|
Advanced Thermal Solutions, Inc.
|
| ATS-1043-C2-R0DS |
maxiFLOW Cross Cut High Performance Heat Sinks with Metal Push Pin
|
Advanced Thermal Solutions, Inc.
|
| ATS-1042-C2-R0DS |
maxiFLOW Cross Cut High Performance Heat Sinks with Metal Push Pin
|
Advanced Thermal Solutions, Inc.
|
| ATS-54310W-C1-R0-17 |
High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments
|
Advanced Thermal Soluti...
|
| BDN21-3CB-A01 BDN21-3CB/A01 |
Adhesive peel and stick heat sinks
|
CTS Corporation
|
| AS3654 |
Power Management Unit with 18 Bit Audio DAC Headphone Amplifier, DCDC Charger, 3 Buck DCDCs, 3 Boost DCDCs, 5 LDOs, Current Sinks, ADC
|
ams AG
austriamicrosystems AG
|
| ATS-19G-116-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
