| PART |
Description |
Maker |
| EKS |
Aluminum Electrolytic Capacitors, Radial Style, Polarized AI Electrolytic Capacitor, High C-U Product, Small Dimensions, Long Lifetime, Extended Temp Range (105°C)
|
Vishay
|
| S558-5999-Z6 |
Extended Temp Xfmr Module
|
BEL FUSE INC
|
| FM20L08 FM20L08-60-TG |
1Mbit Bytewide FRAM Memory - Extended Temp
|
List of Unclassifed Manufacturers
ETC[ETC]
|
| SOM-AB5810DC-00A1E SOM-AB5810-15 SOM-AB5810AC-00A1 |
Extended Temp Mini-ITX Application Board
|
Advantech Co., Ltd.
|
| XQV1000 XQC100-4CG560M XQC1000-4CG560M XQC300-4CG5 |
QPro Virtex 2.5V QML high-reliability FPGA. SMD number 5962-9957201NNA.
QPro Virtex 2.5V QML High-Reliability FPGAs FPGA, 1536 CLBS, 322970 GATES, PBGA352
QPro Virtex 2.5V QML High-Reliability FPGAs FPGA, 661111 GATES, PBGA432
QPro Virtex 2.5V QML High-Reliability FPGAs QPro的Virtex 2.5V的QML第高可靠性的FPGA
QPro Virtex 2.5V QML high-reliability FPGA. SMD number 5962-9957301NUA
QPro Virtex 2.5V QML high-reliability FPGA. SMD number 5962-9957201NUA.
|
Xilinx, Inc.
|
| BR93L46RF-LE2 BR93L46RFV-WE2 BR93L46RFJ-WE2 BR93L4 |
High Reliability Serial EEPROMs High Reliability Series
High Reliability Serial EEPROMs High Reliability Series
|
Rohm
|
| M20-9612645 M20-9601846 M20-9610445 M20-9972245 M2 |
2.54mm Pitch SIL Extended Pin Header, 16.8mm board-stacking height, gold (hi-temp mould), 26-way 26 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL Extended Pin Header, 16.8mm board-stacking height, tin, 18 18-way 36 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch SIL Extended Pin Header, 16.8mm board-stacking height, gold (hi-temp mould), 4-way 4 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL Vertical PC Tail Pin Header, 8.5mm mating pin height, gold (hi-temp mould), 22 22-way 44 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch SIL Extended Pin Header, 16.8mm board-stacking height, gold (hi-temp mould), 20-way 20 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch SIL Extended Pin Header, 16.8mm board-stacking height, tin, 12-way 12 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL Vertical PC Tail Pin Header, 8.5mm mating pin height, tin, 3 3-way 6 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL Vertical PC Tail Pin Header, 8.5mm mating pin height, tin, 23 23-way 46 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL Extended Pin Header, 16.8mm board-stacking height, gold (hi-temp mould), 5 5-way 10 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch SIL Extended Pin Header, 16.8mm board-stacking height, gold (hi-temp mould), 31-way 31 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL Vertical PC Tail Pin Header, 8.5mm mating pin height, tin, 37 37-way 74 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL Extended Pin Header, 16.8mm board-stacking height, tin, 7 7-way 14 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
|
Harwin PLC
|
| EC2-12ND EC2-12SND EC2-24ND EC2-24SND EC2-3ND EC2- |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type 高绝缘，高击穿电压，结构紧凑，重量轻，表面安装型
Driver IC; Package/Case:24-SSOP; Supply Voltage Max:5.25V; Leaded Process Compatible:No; Operating Temp. Max:70 C; Operating Temp. Min:-10 C; Peak Reflow Compatible (260 C):No; Frequency:20GHz; Interface Type:Serial
|
TE Connectivity, Ltd.
NEC, Corp.
NEC Corp.
|
| 2N3501CSM4 |
HIGH VOLTAGE, MEDIUM POWER, NPN TRANSISTOR IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS
High Voltage Medium Power NPN Transistor In a Hermetically Sealed Cermic Surface Mount Package For High Reliability Application(高电压、中等功率、高可靠性、NPN晶体管（陶瓷表贴封装
|
SemeLAB
SEME-LAB[Seme LAB]
|
| AM29LV800BT-80DTC2 AM29LV800BT-80DGI2 AM29LV800BT- |
25NS,OTP CERDIP,883C; LEV B FULLY CMPLNT(EPLD)
20NS, OTP, PLCC, COM TEMP(EPLD)
20NS, SOIC, IND TEMP(EPLD)
25NS, SOIC, COM TEMP(EPLD)
20NS,OTP LCC,883C; LEVEL B FULLY CMPLNT(EPLD)
10MHZ, 8 DIP, COM TEMP(FPGA)
10MHZ, 20 PLCC, IND TEMP(FPGA)
10MHZ, 32 TQFP, COM TEMP(FPGA)
10MHZ, 44 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA)
8 TSSOP,PB/HALO FREE,IND,1.8V(SERIAL EE)
DIE SALE, 1.8V, 11 MIL(SERIAL EE)
8 PDIP,PB/HALO FREE,IND TEMP,1.8V(SERIAL EE)
65K CONFIG MEM, 20 PLCC, IND TEMP(FPGA)
10MHZ, 20 SOIC, IND TEMP(FPGA)
128K CONFIG MEM, 20 PLCC, COM(FPGA)
EEPROM EEPROM
10MHZ, 8 NSOIC, COM TEMP(FPGA) EEPROM
512K X 16 FLASH 3V PROM, 120 ns, UUC44
10MHZ, 8 LAP, 5K MOQ(FPGA)
10MHZ, 8 N-SOIC, COM TEMP(FPGA)
10MHZ, 20 PLCC, COM TEMP(FPGA)
512K X 16 FLASH 3V PROM, 80 ns, UUC44
|
ADVANCED MICRO DEVICES INC
|
| AM29LV800BB-120WBI AM29LV800BB-120WBC AM29LV800BB- |
30MHZ, 3.3V, 44 TQFP, IND TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA)
8-TSSOP,AUTO,Pb/HALO FREE,NIPDAU LF 2.5V(SERIAL EE)
10MHZ, 20 SOIC, COM TEMP, 5K MOQ(FPGA)
10MHZ, 20 SOIC, IND TEMP, 5K MOQ(FPGA)
30MHZ, 3.3V, 44 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 44 TQFP, COM TEMP(FPGA)
30MHZ, 8 LAP, IND TEMP, GREEN(FPGA) x8/x16闪存EEPROM
x8/x16 Flash EEPROM x8/x16闪存EEPROM
32M CONFIG FLASH, 44 PLCC, GREEN(FPGA) x8/x16闪存EEPROM
512K X 16 FLASH 3V PROM, 120 ns, PDSO44
512K X 16 FLASH 3V PROM, 120 ns, PDSO48
10MHZ, 8 PDIP, COM TEMP, 5K MOQ(FPGA)
|
Analog Devices, Inc.
ADVANCED MICRO DEVICES INC
|
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