| PART |
Description |
Maker |
| HN2E04F |
MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application
|
Toshiba Corporation
Toshiba Semiconductor
|
| SSM5H16TU |
Silicon N Channel MOS Type (U-MOS3)/Silicon Epitaxial Schottky Barrier Diode
Multi-chip discrete device (N-ch SBD)
|
Toshiba Semiconductor
|
| TPCP8J01 |
TOSHIBA Multi-chip Device Silicon P Channel MOS Type (U-MOSIV) Silicon NPN Epitaxial Type
TOSHIBA Multi-chip Device Silicon P Channel MOS Type (U-MOSIV) /Silicon NPN Epitaxial Type
MOSFET TPC Series
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| TPCF8B0107 |
TOSHIBA Multi-Chip Device Silicon P Channel MOS Type (U-MOS III) / Schottky Barrier Diode
|
Toshiba Semiconductor
|
| AS8S128K32PN-17/XT AS8S128K32PN-25/XT AS8S128K32PN |
128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, PGA66 PGA-66
128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PGA66 PGA-66
128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PGA66 PGA-66
128K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PGA66 PGA-66
128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 CERAMIC, QFP-68
|
Micross Components
Austin Semiconductor, Inc
|
| SYS321000LK-012 SYS321000LK-015 SYS321000ZK-015 SY |
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZIP72 PLASTIC, ZIP-72
1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZIP72 PLASTIC, ZIP-72
x32 SRAM Module X32号的SRAM模块
1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PZIP72 PLASTIC, ZIP-72
|
Sumida, Corp.
TE Connectivity, Ltd.
|
| ISD1100P ISD1100X ISD1112 ISD1110 ISD1120 ISD1110P |
Single-Chip Voice Record/Playback Device（Single-chip Durations of 12 seconds)(单片的录录音重放一片信息存储持续时12秒）) 单芯片语音记播放设备（单芯片的持续时12秒）（单片的录音/录音重放器（一片信息存储持续时12秒）
Single-Chip Voice Record/Playback Devices 10- and 12-Second Durations(单片声音录音/回放芯片(单片信息存储持续时间12秒钟))
Single-Chip Voice Record/Playback Device（Single-chip Durations of 10 seconds)(单片的录录音重放一片信息存储持续时0秒）)
Single-Chip Voice Record/Playback Device（Single-chip Durations of 12 seconds)(单片的录录音重放一片信息存储持续时2秒）)
SINGLE CHIP VOICE RECORD / PLAYBACK DEVICES
RES POWER .360 OHM 1W 5% SMT
|
List of Unclassifed Manufacturers
Winbond Electronics, Corp.
Winbond Electronics Corp
ETC
Electronic Theatre Controls, Inc.
|
| MF3128-MLDAP01 MF3256-MLDAP01 MF3512-MLDAP01 |
128K X 8 MULTI DEVICE SRAM CARD, 200 ns, XMA60
256K X 8 MULTI DEVICE SRAM CARD, 200 ns, XMA60
512K X 8 MULTI DEVICE SRAM CARD, 200 ns, XMA60
|
|
| CYM1836 1836 CYM1836PZ-45C CYM1836P8-15C CYM1836P8 |
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, ZMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, SMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, SMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 30 ns, SMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 30 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 30 ns, ZMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, SMA64
From old datasheet system
|
Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
CYPRESS[Cypress Semiconductor]
|
|
