| PART |
Description |
Maker |
| 449-10-204-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 449-10-208 449-10-208-00-560000 |
Interconnect Header .100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 349-10-105-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 414-43-272-41-117000 |
Interconnect Socket .100 Grid; Surface Mount Socket Stub Tail Double Row Surface Mount Accepts .015-.025" Leads
Interconnect Socket .100 Grid; Surface Mount Socket Stub Tail Double Row Surface Mount Accepts .015-.025 Leads
|
Mill-Max Mfg. Corp.
|
| 0901200776 90120-0776 |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 16 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0901210769 90121-0769 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, 9 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, 9 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0702871293 |
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 100 Circuits, 8.13mm (.320) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective
|
Molex Electronics Ltd.
|
| 829-22-007-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-020-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-011-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
